Applied Materials, Inc.

Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage

Rajeev Bajaj

Jason Garcheung Fung

Puneet Narendra Jawali

Nandan Baradanahalli Kenchappa

Ashwin Chockalingam

Veera Raghava Reddy Kakireddy

Andrew Scott Lawing

Adam Wade Manzonie

Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.

Polishing pads with interconnected pores

Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.

Advanced polishing pads and related polishing pad manufacturing methods

Growing community of inventors

Santa Clara, CA, United States of America

Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage