Hgst Netherlands, B.v.

Headway Technologies, Incorporated

Shiwen Huang

Yingjian Chen

Jiun-Ting Lee

Kyusik Shin

Yoshitaka Sasaki

Fenglin Liu

Yuming Zhou

Feiyue Li

Cherng-Chyi Yan

Hardayal Singh Gill

Quang Le

Moris Musa Dovek

Wen-Chien David Hsiao

Edward Hin Pong Lee

Suping Song

Yi Zheng

Xiaoyong Liu

Sue Siyang Zhang

Guangli Liu

Qiping Zhong

Edward H P Lee

Valeri Synogatch

Mun Hyoun Park

Embodiments disclosed herein generally relate to a magnetic head having a sensor stack and a bias material that is aligned in a direction perpendicular to a media facing surface. The sensor stack and a first portion of the bias material are laterally bookended by synthetic antiferromagnetic (SAF) structures, and a second portion of the bias material is laterally bookended by a dielectric material. In this configuration, the SAF structures are decoupled from the bias material, which minimizes the disturbance to the bias material.

Scissor reader with side shield decoupled from bias material

The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.

Method for manufacturing wraparound shield write head using hard masks

In one embodiment, a magnetic head includes a main pole having a trapezoidal cross-section at a media-facing surface thereof and a flared shape with a greater width in a cross-track direction at positions away from the media-facing surface, a leading shield positioned near a leading side of the main pole, wherein a leading gap is provided between the main pole and the leading shield, side shields positioned on both sides of the main pole in the cross-track direction adjacent the media-facing surface of the main pole, with side gaps provided between the main pole and both of the side shields, and a trailing gap provided on a trailing side of the main pole at the media-facing surface thereof, with a throat height of the side shields being less than the throat height of the side shields at a position closer to the trailing gap than the leading gap.

Tapered leading and side shields for use in a perpendicular magnetic recording head

A write head for use in a magnetic disk drive and methods of manufacturing the same. When a non-magnetic reactive ion etching (RIE) stop layer is used in a damascene main pole fabrication process, the leading edge shield and the side shield have a magnetic separation. By replacing a non-magnetic RIE stop layer with a magnetic RIE stop layer, no removal of the RIE stop layer around the main pole is necessary. Additionally, the leading edge shield and the side shield will magnetically join together without extra processing as there will be no magnetic separation between the leading edge shield and the side shield.

Use of magnetic material for RIE stop layer during damascene main pole formation

A perpendicular write head having a wrap around shield and a conformal side gap. In fabricating the write head, the leading edge shield may be chemical mechanical polished down to a level that is substantially even with a chemical mechanical polishing stop layer. Because the leading edge shield and the chemical mechanical polishing stop layer are used as RIE stop for trench RIE, a fully conformal side shield may be formed with a LTE/LES.

Perpendicular write head with wrap around shield and conformal side gap

A non-conformal integrated side shield structure is disclosed for a PMR write head wherein the sidewalls of the side shield are not parallel to the pole tip sidewalls. Thus, the side gap distance between the leading pole tip edge and side shield is different than the side gap distance between the trailing pole tip edge and side shield. As a result, there is a reduced side fringing field and improved overwrite performance. The side gap distance is constant with increasing distance from the ABS along the main pole layer. A fabrication method is provided where the trailing shield and side shield are formed in the same step to afford a self-aligned shield structure. Adjacent track erasure induced by flux choking at the side shield and trailing shield interface can be eliminated by this design. The invention encompasses a tapered main pole layer in a narrow pole tip section.

Method to make an integrated side shield PMR head with non-conformal side gap

Method to make an integrated side shield PMR head with non conformal side gap

Improved writability and a sharper neck transition are achieved in a PMR writer with a yoke that has essentially vertical sidewalls and a write pole that has sidewalls with a beveled angle. An alumina mold is made with a negative differential bevel angle by employing a two mask process. A first photoresist layer is patterned and etched to form a rectangular trench in an alumina layer. The trench extends beyond the intended ABS plane and in the opposite direction into the intended yoke area. A second photoresist layer is patterned into a yoke shape that is partially superimposed over the rectangular trench. After a second RIE process, the yoke opening adjoins the trench at a neck transition point along each long trench side. The volume of magnetic material in the yoke adjacent to the neck is thereby maximized. Dimension control of the main pole becomes independent of ABS positioning errors.

PMR with improved writability and process controllability by double layer patterning

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Fremont, CA, United States of America

Shiwen Huang