Saint-gobain Abrasives, Inc.

Saint-gobain Abrasifs

University of Massachusetts

Shivshankar Sivasubramanian

Srinivasan Ramanath

Rachana Upadhyay

Ramanujam Vedantham

Signo T Reis

Arup K Khaund

Ramaswamy Nagarajan

Yinggang Tian

Joey L Mead

John J Pearlman

Linda S Bateman

Cecile O Mejean

Taewook Hwang

John Tunstall

Julie Chen

Sharavanan Balasubramaniam

Mario J Cazeca

Andrew L Biro

Lisa A Johnson

Rajesh Kaul

Michael D Cheng

Jungrae Park

An abrasive article including a body having a bond material comprising an inorganic material, abrasive particles contained within the bond materials; and pores contained within the bond material defining a porosity of at least 90 vol % and not greater than 97 vol % for a total volume of the body.

Abrasive articles and method of forming same

A grinding tool includes a shank having an axis, and at least two abrasive portions mounted directly to and in contact with the shank without a hub therebetween. Each of the abrasive portions has a substantially identical profile formed therein.

Grinding and polishing tool

An abrasive article including a bonded abrasive body having a bond material made of a vitrified material, abrasive particles comprising a first type of superabrasive material contained in the bond material, a porosity of at least about 50 vol % of the total volume of the bonded abrasive body, and a &#x394;CTE of not greater than about 5.5 ppm/&#xb0; C., wherein &#x394;CTE is defined as a difference between a CTE of the bond material and a CTE of the abrasive particles.

Wireless strain and displacement sensors wirelessly monitor structural health and integrity, and are made by printing inductor-interdigital capacitor sensing circuits on a variety of substrates, including ceramic substrates, with thermally processable conductive inks. Sensors of the invention can be employed to detect strain and displacement of civil structures, such as bridges and buildings. The sensors include sensing elements that are mounted or printed on stiff, inflexible substrates, which prevent the sensing elements from bending, stretching, or otherwise warping when the sensor is strained. An interlayer between the sensing elements allows the sensing elements to move with respect to each other during application of strain. Thus, strain causes the sensing elements to move but not to deform, causing changes in sensor resonance that can be detected through wireless radio-frequency interrogation. Because the sensing elements do not change shape when under strain, the sensor can undergo millions of measurement cycles before breaking.

Wireless passive radio-frequency strain and displacement sensors

Growing community of inventors

Lowell, MA, United States of America

Shivshankar Sivasubramanian