Tesla, Inc.

Waymo LLC

Altera Corporation

Shishuang Sun

Mengzhi Pang

Ganesh Venkataramanan

Sabareeshkumar Ravikumar

Feng Wang

Ji Zhang

Satyan Chandra

Zhe Li

Kevin Altair Hurd

William McGee

Peter Boyle

Jin Zhao

Iliya G Zamek

Steven Wayne Butler

James L Drewniak

Sandeep Kamalakar Reddy Chandra

Bozidar Krsnik

Vijaykumar Krithivasan

Robert Yinan Cao

Mitchell Heschke

Xiaohe Chen

A structure with an electronic component array positioned between two stacked printed circuit boards () is disclosed. The electronic components () of the array can be connected to the printed circuit board () by way of solder connections. Example electronic components () include capacitors. Related methods of manufacture are disclosed that involve applying heat to a solder paste array on a printed circuit board () to form solid conductors electrically connected to the electronic components ().

Stacked component array structure

An electronic assembly includes a mechanical carrier, a plurality of integrated circuits disposed on the mechanical carrier, a fan out package disposed on the plurality of integrated circuits, a plurality of singulated substrates disposed on the fan out package, a plurality of electronic components disposed on the plurality of singulated substrates, and at least one stiffness ring disposed on the plurality of singulated substrates. A method for constructing an electronic assembly includes identifying a group of known good singulated substrates, joining the group of known good singulated substrates into a substrate panel, attaching at least one bridge to the substrate panel that electrically couples at least two of the known good singulated substrates, and mounting a plurality of electronic components onto the substrate panel, each electronic component of the plurality of electronic components corresponding to a respective known good singulated substrate.

Electronic assembly having multiple substrate segments

One example method of testing an electrical device comprises transmitting a data pattern to a memory device of the electrical device by a controller of the electrical device to provide a written data pattern to the memory device, wherein the data pattern replicates a resonant frequency of at least a portion of the electrical device, reading the written data pattern from the memory device with the controller, and comparing the written data pattern to the data pattern.

Memory validation

Described is a multi-chip module that may include a Redistribution Layer (RDL) substrate having Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate. A second plurality of IC dies may be mounted to an opposite second surface. A plurality of sockets can be mounted upon the second plurality of IC dies and a cold plate then mounted to the first plurality of IC dies. The mounting structure may include socket frames coupled to the plurality of sockets.

Mechanical architecture for a multi-chip module

An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.

Electronic assembly

A Voltage Regulator Module (VRM) includes a first voltage rail circuit board oriented in a first plane having formed therein a first plurality of conductors and configured to produce a first rail voltage, a second voltage rail circuit board oriented in a second plane that is substantially parallel to the first plane having formed therein a second plurality of conductors and configured to produce a second rail voltage. The VRM also includes a first capacitor circuit board oriented in a third plane that is substantially perpendicular to the first plane and a second capacitor circuit board oriented in a fourth plane that is substantially parallel to the third plane. The VRM includes a plurality of conductors intercoupling the first voltage rail circuit board, the first capacitor circuit board, the second voltage rail circuit board, and the second capacitor circuit board.

High power voltage regulator module with different plane orientations

An electronic assembly () includes a mechanical carrier (), a plurality of integrated circuits (A,B) disposed on the mechanical carrier, a fan out package () disposed on the plurality of integrated circuits, a plurality of singulated substrates (A,B) disposed on the fan out package, a plurality of electronic components (A,B) disposed on the plurality of singulated substrates, and at least one stiffness ring (A,B,C) disposed on the plurality of singulated substrates. A method for constructing an electronic assembly includes identifying a group of known good singulated substrates, joining the group of known good singulated substrates into a substrate panel, attaching at least one bridge to the substrate panel that electrically couples at least two of the known good singulated substrates, and mounting a plurality of electronic components onto the substrate panel, each electronic component of the plurality of electronic components corresponding to a respective known good singulated substrate.

A method for determining a current spectrum for a circuit design is provided. The method includes determining timing characteristics and power consumption characteristics for the circuit design. From the timing characteristics and the power consumption characteristics a time domain current waveform is constructed. The time domain current waveform is then converted to a frequency domain current waveform. With the frequency domain waveform, one skilled in the art can then identify a location and an amount of decoupling capacitors for a printed circuit board housing the circuit design based on the frequency domain current waveform. A computing system configured to perform the method is also provided.

Growing community of inventors

Cupertino, CA, United States of America

Shishuang Sun