Tdk Corporation

Shirou Ootsuki

Yoji Tozawa

Satoshi Kurimoto

Ko Onodera

Hiroyuki Arioka

Masahito Furukawa

Akitoshi Yoshii

Taisuke Ahiko

Yukihiko Shirakawa

Syuji Tsukamoto

Takashi Horai

Saori Takeda

Takashi Aoki

Satoshi Wada

Atsushi Takeda

Toshihiko Kaneko

Hiroki Uchiyama

Shinya Onodera

Nobuyuki Okuzawa

Masanori Kosuda

Yukie Nakano

Yoshitaka Murakawa

Yuki Yamashita

Shota Suzuki

Raitarou Masaoka

Yuiko Hirose

Yuji Sezai

Wakiko Sato

Akira Goshima

Hiromi Kikuchi

Hiroki Houchi

Takaji Shimosaka

Minoru Ookoba

Masatoshi Takizawa

Shintaro Ueno

Daisuke Hirose

Yuya Hattori

Yasunori Harada

Miki Kimura

Provided is a ferrite magnet including: magnetoplumbite type ferrite crystal grains; and a grain boundary phase interposed between the ferrite crystal grains. The ferrite crystal grains and the grain boundary phase respectively contain a metal element A, La, Co, and Fe, the metal element A is at least one kind of element selected from the group consisting of Sr, Ba, and Ca, and when an atomic ratio of Co to La in the ferrite crystal grains is set as R, and an atomic ratio of Co to La in the grain boundary phase is set as R, the following expression is satisfied.0.5≤R/R≤0.9

Ferrite sintered magnet, and method of manufacturing ferrite sintered magnet

A dielectric composition including a complex oxide containing bismuth, zinc, and niobium, includes a crystal phase formed of the complex oxide and having a pyrochlore type crystal structure, and an amorphous phase. When the complex oxide is represented by a composition formula BiZnNbO, in which x, y, and z satisfy relations of x+y+z=1.00, 0.20&#x2264;y&#x2264;0.50, and 2/3&#x2264;x/z&#x2264;3/2.

Dielectric composition and electronic component

A composite structure including a conductor region that is configured from a first oxide, and an insulator region that is configured from a second oxide and that surrounds the conductor region, wherein the first oxide and the second oxide are in hetero structure with each other. A powder and a fired body each having such a composite structure are also preferable.

Composite structure, fired body having composite structure, powder including particle having composite structure, and dielectric element including dielectric having composite structure

A piezoelectric film containing (K,Na)NbOas the main component, wherein, when a surface of the piezoelectric film was observed in a field view within a specified range, a plurality of first crystals and a plurality of second crystals are arranged in the surface of the piezoelectric film, wherein, the first crystal has a slender shape orientating toward the first orientation along the surface, and the second crystal has a slender shape orientating toward the second orientation which crosses with the first orientation along the surface.

Piezoelectric film, piezoelectric film element, piezoelectric actuator, piezoelectric sensor, hard-disk drive and ink jet printer head

The present invention relates to a dielectric element such as a thin-film capacitor including a dielectric film. The dielectric film contains a main component represented by the general formula (BaCa)(TiZr)Owherein 0&#x3c;x&#x2264;0.500, 0&#x3c;y&#x2264;0.350, and 0.900&#x2264;z&#x2264;0.995. The dielectric film includes a layer containing columnar crystal grains and a layer containing spherical crystal grains, and contains as a sub-component at least one of divalent metal elements and trivalent metal elements.

Dielectric film and dielectric element

A dielectric composition contains major components that are an A-group containing major components that are at least two selected from the group consisting of Ba, Ca, and Sr and a B-group which contains a major component that is selected from Zr and Ti and which contains at least Zr. The dielectric composition contains an amorphous substance containing the A-group and the B-group and a crystalline substance containing the A-group and the B-group. In the dielectric composition, the inequality 0.5&#x2266;&#x3b1;&#x2266;1.5 holds, where &#x3b1; is the molar ratio of the A-group to the B-group.

A dielectric ceramic composition comprising a compound expressed by a formula of ABO, where 'A' is Ba alone, or Ba and at least one selected from Ca and Sr, and 'B' is Ti alone, or Ti and Zr, and having a perovskite-type crystal structure, and an oxide of a rare-earth element including Sc and Y. The dielectric ceramic composition includes a dielectric particle having a core-shell structure which has a core and a shell, the shell being present around the core and including at least &#x201c;R&#x201d; element, and in the shell, a region showing a maximum content rate of &#x201c;R&#x201d; element is a boundary region between the core and the shell.

Dielectric ceramic composition and ceramic electronic device

A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

External electrode forming method

An element forming an electronic component has a first face and a second face facing each other, and a third face adjacent to each of the first face and the second face. A method of forming an external electrode of the electronic component involves a pre-formation step, first to third formation steps, and an electrode formation step. The pre-formation step is to apply a conductive paste onto the third face and to evaporate at least a part of a liquid contained in the applied conductive paste, to form a precoat portion expected to become a part of a third electrode portion. The first formation step is to apply the conductive paste from a direction opposite to the first face, onto the first face to form a first electrode portion. The second formation step is to apply the conductive paste from a direction opposite to the second face, onto the second face to form a second electrode portion. The third formation step is to apply the conductive paste onto the third face so as to cover the precoat portion, to form the third electrode portion. The electrode formation step is to dry the element to form the external electrode consisting of the first electrode portion, the second electrode portion, and the third electrode portion. The first electrode portion, the second electrode portion, and the third electrode portion are formed so as to connect with each other.

A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic sintered body. The external electrode has a first electrode layer formed on the external surface of the ceramic sintered body, a second electrode layer formed on the first electrode layer, and a conductive resin layer formed on the second electrode layer. The internal electrode and the first electrode layer consist primarily of a base metal. The second electrode layer consists primarily of a noble metal or a noble metal alloy. The conductive resin layer contains a noble metal or a noble metal alloy as a conductive material.

Ceramic electronic component and multilayer capacitor

A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the chip element body. The chip element body has one side face acting as a mounting surface opposing a circuit substrate. The pair of terminal electrodes include an electrode portion formed on the mounting surface. Here, it is assumed that a first direction is a direction orthogonal to the mounting surface, a second direction is a direction along which the pair of terminal electrodes oppose each other on the mounting surface, and a third direction is a direction orthogonal to the first and second directions. A first length of the electrode portion along the second direction from an edge portion of the mounting surface at a center region in the third direction is set longer than a second length of the electrode portion along the second direction from the edge portion of the mounting surface at both end regions in the third direction.

Chip-type electronic component

On a recording layer () of a disc-shaped optical recording medium (), a plurality of virtual recording cells () are assumed contiguously in a spiral or concentric fashion in a groove (). The irradiation time of the laser beam is modulated in five stages or more for each of the virtual recording cells () in response to information to be recorded, thereby forming recording marks (A toG) of different sizes in five stages or more. The optical reflectivity of the virtual recording cell () is modulated in multi-stages to thereby vary the reflection level of a reading laser beam for reading operations in five stages or more. The length of the virtual recording cells () in the rotational direction of the disc is set to be equal to that of an arc having the same center angle with respect to the center of the disc.

Optical recording medium and optical recording method by irradiation

The object of the present invention is to provide a flat-panel-display substrate which is high in heat resistance, of which the coefficient of thermal expansion is approximated to that of a thick film dielectric layer, which is low at high temperatures in reactivity with the lead-doped thick film dielectric layer, and which can be made to have a large area. The substrate of the present invention is obtained by sintering a body comprising glass powder and a filler made of metal and/or semi-metal oxide, and is constituted by the sintered body and whose average coefficient of linear thermal expansion is from 7 to 9.5 ppm/&#xb0; C. in the temperature range of 25 to 700&#xb0; C. The glass powder includes alkaline-earth oxide, 15 to 50% by weight of silicon oxide, and no greater than 2% by weight of boron oxide. Furthermore, the filler is at a concentration of 10 to 30% by volume of the total amount of the glass powder and the filler in the mould.

Substrate for flat panel display and thin film electroluminecence element

A thin-film EL device includes a lower electrode layer, a barrier layer containing a conductive inorganic compound, a lower insulating layer, a light emitting layer, and an upper electrode layer stacked in order on an electrically insulating substrate. An EL device of high display quality is established at a low cost by acquiring satisfactory light emitting properties without using an expensive high-melting point noble metal in the lower electrode layer and without increasing the thickness of the lower electrode layer, even when the lower insulating layer contains a lead base dielectric material.

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Tokyo, Japan

Shirou Ootsuki