Canon Kabushiki Kaisha

Shiro Sujaku

Satoshi Ibe

Jun Yamamuro

Kouji Hasegawa

Yoshinori Tagawa

Junya Hayasaka

Hiroto Komiyama

Keiji Watanabe

Toshiaki Kurosu

Shuhei Oya

Mitsunori Toshishige

Kenji Takahashi

Hiroyuki Murayama

Noriyasu Ozaki

Daisuke Otsuka

A liquid discharge head includes a recording element substrate including a discharge port configured to discharge a liquid, a pressure generating element configured to pressurize the liquid to discharge the liquid, and an electric connecting portion connected to the pressure generating element through an electric wiring and configured to supply power for driving the pressure generating element to the pressure generating element. The liquid discharge head includes a first recessed portion and a second recessed portion formed in a range from a back surface of a discharge port surface in which the discharge port of the recording element substrate is formed up to the electric connecting portion, and a communicating portion configured to connect a space formed within the first recessed portion and a space formed within the second recessed portion by allowing the first recessed portion and the second recessed portion to communicate with each other.

Liquid discharge head and manufacturing method therefor

A liquid ejection head is equipped with a substrate having therethrough a supply path to be supplied with a liquid, a top plate placed opposite to the substrate, having an ejection orifice for ejecting the liquid and constituting, between the top plate and the substrate, a flow path communicated with the supply path and the ejection orifice and a columnar member extending from the top plate to the inside of the supply path through the flow path. An end surface of the columnar member positioned in the supply path is tilted relative to the top plate in a direction away from the ejection orifice.

Liquid ejection head and method of manufacturing same

A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.

Method for manufacturing liquid-discharge-head substrate

A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.

Method for producing liquid-ejection-head substrate and liquid-ejection-head substrate produced by the same

A method for manufacturing a liquid ejection head having a substrate, heat generating elements formed at the front surface side of the substrate, and a nozzle layer forming liquid chambers and liquid ejection ports at the front surface side of the substrate, and the method includes a process of preparing a substrate having heat generating elements and a nozzle layer formation material layer at the front surface side, a process of driving the heat generating elements for heating to form air bubbles serving as the liquid chambers in the nozzle layer formation material layer, and a process of forming liquid ejection ports which communicate with the liquid chambers in the nozzle layer formation material layer, and then forming a nozzle layer forming the liquid chambers and the liquid ejection ports at the front surface side of the substrate.

Method for manufacturing liquid ejection head

A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.

Liquid ejection head and method for manufacturing liquid ejection head

An object of the present invention is to provide a liquid ejection head capable of suppressing the capture of bubbles into the liquid ejection head including ejection ports having different opening areas so as to satisfactorily fill a liquid channel and the ejection ports with liquid. In order to achieve the object, the liquid ejection head according to the present invention includes a liquid supply port communicating with a plurality of kinds of ejection ports, and further, a defoaming opening communicating with another ejection port except an ejection port having a large opening area out of the plurality of kinds of ejection ports via a defoaming channel.

Liquid ejection head and fabricating method therefor

A device substrate includes a substrate body having an energy generating device provided thereon, where the energy generating device generates energy for ejecting liquid, an ejection port forming member disposed on the substrate body, where the ejection port forming member has a pressure chamber that surrounds the energy generating device and an ejection port that communicates with the pressure chamber, and a supply port configured to supply the liquid to the pressure chamber. The ejection port forming member has a first surface that is in contact with the substrate body and a second surface other than the first surface, and the supply port is formed in the second surface.

Device substrate, liquid ejection head, and method for manufacturing device substrate and liquid ejection head

A liquid ejection head and a printing apparatus can perform high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section is formed on the side surface of the substrate.

Liquid ejection head and printing apparatus

A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.

The method of manufacturing a liquid ejection head includes: forming a first protective layer on one surface of the substrate; forming the wiring layer on another surface of the substrate; forming the insulating layer on the wiring layer, and then partially removing the insulating layer to partially expose the wiring layer; forming the electrode pad on an exposed portion of the wiring layer; forming a flow path member on the another surface of the substrate; forming a second protective layer on the one surface of the substrate after the formation of the flow path member; and partially removing at least one of the first protective layer and the second protective layer, and then forming the supply port leading from the one surface of the substrate to the another surface of the substrate.

Growing community of inventors

Kawasaki, Japan

Shiro Sujaku