Chisso Corporation

Shiro Konotsune

Kouichi Kunimune

Kazutsune Kikuta

Yoshiya Kutsuzawa

Takao Kawamoto

Hiroshi Shimizu

Hitoshi Yano

Hiroaki Hase

Atsuyuki Kachi

Hiromi Higashi

Masami Wada

Kazuyuki Tsuji

Hiroshi Maehara

Atsushi Takahashi

Masaya Uetsuki

Akihiro Sato

Akihiro Satoh

Shouichi Fukunaga

Hiromi Egawa

Souichiro Hiraki

Metal-clad laminates and method for producing same

A method for producing circuit boards with a film having improved printing properties, adhesion, flexibility and heat resistance which comprises applying a liquid printing ink composition comprising an admixture of a solvent, a polyamide-acid and a partially imidized polyamide-acid, then heat to effect drying and curing.

Method for producing printed circuit boards

A flexible copper-applied substrate comprises a copper foil and a resin layer comprising a composite material of a polyimide and a polyimide silicone, the resin layer being directly formed on the surface of the copper foil, said substrate being producible by applying a polyamide acid composite composed of a mixed solution of a polyamide acid and a polyamide acid alkylsilane to a copper foil and heating.

Flexible copper-applied substrates

A flexible double-sided copper-clad printed-circuit base board is provided with a core resin layer of a composite material essentially composed of a specific rigid-structured polyimide and a specific flexible-structured crosslinked polyimide silicone in a state of being inseparable from each other, wherein the core resin layer is formed directly between two copper foils. This base board is produced by coating a surface of a copper foil with a polyamic acid solution mixture of a specific polyamic acid and a specific polyamic acid - alkylsilane, heat-treating the resulting coated copper foil, and contact-bonding another copper foil to the resulting copper-foil/polyimide laminate.

Flexible printed-circuit base board and process for producing the same

In a process for producing a flexible printed base by directly coating a copper foil with a polyimide precursor, followed by heating, drying and curing, a process affording a flexible printed base having a superior folding endurance and a good heat resistance at a cheap cost is provided, which process comprises carrying out the curing in an inert gas under a tension of 0.02 to 0.2 Kg/cm and at 200.degree. and 450.degree. C.

Process for producing a flexible printed base

A polyimide having a low elastic modulus and also superior heat resistance and mechanical characteristics and soluble in solvents and a process for producing the same are provided,

Polyamide having a low elastic modulus and a process for producing the

A process for producing a silicon-containing polyamic acid affording a silicon-containing polyimide having a low thermal expansion coefficient and a process for producing the silicon-containing polyimide are provided, the former process comprising reacting pyromellitic acid dianhydride (A.sup.1 mols) and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (A.sup.2 mols) with a diamine of the following formula (I) (B mols) and an aminosilicon compound of the formula (II) so as to satisfy the following expressions (III) and (IV): ##STR1## wherein R.sup.1 is methyl, ethyl, methoxy, ethoxy or halogen; R.sup.2 is alkyl or alkyl-substituted phenyl; X is a hydrolyzable alkoxy, acetoxy or halogen; m is 0, 1 or 2; n is 1 or 2; and k is 1, 2 or 3; and

Process for producing a low thermally expansive and highly adhesive

A crystalline polyimide polymer having a practical effectiveness that extrusion or injection molding which has so far been applied to thermoplastic resins, but could not have been achieved by conventional polyimides, are possible due to its melting point in the range of 300.degree. C. to 450.degree. C., and a process for producing the polymer, are provided, which polyimide polymer contains the following imide repetition unit (I) in 30% by mol based on the polymer and containing or not containing at least one of other imide repetition units and also having an inherent viscosity of 0.1 to 5 dl/g in conc. sulfuric acid at 30.+-.0.01.degree. C.: ##STR1## wherein X is divalent CO, divalent SO.sub.2 group, S, O or a single bond.

Melt-moldable crystalline polyimide polymer

A process for producing a silicon-containing polyamic acid of a specified inherent viscosity as a precursor affording polyimide resins having a considerable extent of heat resistance as adhesives or resins for multilayer laminated composite materials, and a good adhesion onto inorganic materials, metals or resins, and a crosslinked silicon-containing polyimide resin prepared from the polyamic acid are provided, which process comprises reacting a tetracarboxylic acid dianhydride of formula (1) (A mols), a diamine of formula (2) (B mols) and an aminosilicon compound of formula (3) (C mols), satisfying the expressions of (4) and (5): ##STR1## wherein R.sup.1 is a tetravalent carboxylic aromatic group; R.sup.2 is an aliphatic, alicyclic, aromatic aliphatic or carboyclic aromatic group each of a specified number of carbon atoms, a specified polysiloxane group, or a formula of ##STR2## wherein R.sup.8 is a specified hydrocarbon group or hydrogen atom; ##STR3## (s: 1 to 4); R.sup.4 is alkyl, phenyl or alkyl-substituted phenyl each of a specified number of carbon atoms; X is alkoxy, acetoxy or halogen; and 1.ltoreq.k.ltoreq.3, and which polyimide resin is produced by baking a solution containing the above polyamic acid at 50.degree. to 450.degree. C.

Process for producing highly adherent silicon-containing polyamic acid

A novel soluble polyimide-siloxane precursor having a good storage stability in solution and forming a superior coating on silicon wafer, glass, etc. under heating conditions of low temperature and short time; a process for producing the same; and a cross-linked polyimidesiloxane obtained by heating the above precursor are provided, which precursor has

Soluble polyimide-siloxane precursor, process for producing same and

A novel soluble polyimide-siloxane precursor useful for forming a superior coating on silicon wafer, glass, etc. and a process for producing the same are provided, which precursor has an imide-amic acid chain part expressed by --R.sup.3 --(I)--R.sup.2 --(I)].sub.n R.sup.3 --, bonded by a bonding structure expressed by --SiR.sup.4.sub.3-m Y.sup.1.sub.m-1 --O--SiR.sup.4.sub.3-m Y.sup.1.sub.m-1 --, wherein (I) is either one of formulas (2), (3) or (4) ##STR1## wherein R.sup.1 is a tetravalent carbocyclic aromatic group; R.sup.2, R.sup.3, R.sup.4 and Y.sup.1 each are a specified group; 1.ltoreq.m.ltoreq.3; the precursor further being terminated by Y.sup.2.sub.m R.sup.4.sub.3-m Si-- wherein Y.sup.2 is a specified group and having a percentage imidization as defined relative to the quantities of (2), (3) and (4), of 50-100% and also an inherent viscosity as specifically defined, of 0.05 to 5 dl/g, the above n being an integer defined so as to give the above inherent viscosity value.

Soluble polyimide-siloxane precursor, process for producing same, and

A soluble imide oligomer represented by the general formula ##STR1## (Definitions of R, R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 are found in the specification.) and its preparation process are presented. A coating solution for electronic materials containing said soluble imide oligomer is also presented.

Soluble imide oligomer and a method for producing the same

A silicon-containing step ladder polymer comprising a unit represented by the following general formula (I): ##STR1## a unit represented by the following general formula (II): ##STR2## and a unit represented by the following general formula (III): ##STR3## where R.sup.1 represents a hydrocarbon or fluorine-substituted hydrocarbon group, R.sup.2 represents hydrogen or a trialkyl siloxy group, and R.sup.3 and R.sup.4 which may be identical or different with each other represent individually hydrocarbon or fluorine-substituted hydrocarbon groups, the molar ratio of the unit (I) to the unit (II) is between 5:1-100:1 and the molar ratio of the unit (III) to the total amount of the unit (I)+unit (II) is between 1:5-1:100, as well as a process for producing such polymer.

Silicon-containing step ladder polymer and a process for producing the

A silicone-polyimide precursor which affords a coating having a conspicuous adhesion onto silicon wafer, glass, etc. and also an improved strength, hardness, etc. after baking, and a process for producing the same are provided,

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Yokosukashi, Japan

Shiro Konotsune