Alps Electric Co., Ltd.

Shiro Ikeda

Satoshi Waga

Shoji Kai

Shunji Kuwana

Ryo Iwasaki

An electronic circuit unit includes a circuit substrate having a rectangular shape and is obtained by cutting an integral substrate along a vertical cut line and a horizontal cut line to be separated; a copper foil land soldered to components; and a substrate outer edge, which is formed by cutting, of two sides orthogonal to each other. The copper foil land and the substrate outer edge are positioned in the vicinity of a corner of the circuit substrate. Solder resist is provided around the copper foil land. A plurality of substrate exposure portions without the solder resist is provided in the vicinity of the substrate outer edge.

Electronic circuit unit and method of manufacturing electronic circuit unit

A method of manufacturing a surface acoustic wave device includes interposing a thermosetting adhesive between the insulator that is inserted in the housing portion while the comb-shaped electrodes are directed upward and a bottom portion of the housing portion, and curing the adhesive by heating in a state in which a conductive member is disposed near the opening portion to come in contact with the comb-shaped electrodes, such that the conductive member is separated from the comb-shaped electrodes. Accordingly, a process of forming a conductive film made of carbon and a process of removing the conductive film are not required. Therefore, it is possible to provide a method of manufacturing a surface acoustic wave device that has high productivity and that prevents pyroelectric breakdown between the comb-shaped electrodes at low cost.

Growing community of inventors

Miyagi-ken, Japan

Shiro Ikeda