Toray Industries, Inc.

Toray Indusries, Inc.

Shiro Honda

Nobuyuki Tomioka

Hiroaki Sakata

Masanori Hirano

Hideki Oka

Takayuki Imaoka

Masato Honma

Noriyuki Hirano

Hiroshi Takezaki

Koji Yamauchi

Shunsuke Horiuchi

Jun Misumi

Masayuki Tanaka

Itaru Asano

Yuki Mitsutsuji

Yasushi Sawamura

Ryuji Sawaoka

Hidekazu Nishino

Takayuki Fujiwara

Shiori Kawamoto

Maki Nagano

Go Tanaka

Hisashi Miyama

Takayoshi Hirai

Kaori Narimatsu

Maki Mizuki

Keiji Kayaba

Toshihiro Teshiba

Hiroko Tanaka

Yuka Isago

Kenshi Miyaura

Koyomi Nakahara

Yuki Maeda

A polysiloxane-polyalkylene glycol block copolymer is obtained by reacting a polysiloxane (A) having any functional group selected from a carboxylic anhydride group, a hydroxyl group, an epoxy group, a carboxyl group, and an amino group with a polyalkylene glycol (B) having any functional group selected from a carboxylic anhydride group, a hydroxyl group, a carboxyl group, an amino group, an epoxy group, a thiol group, and an isocyanate group, wherein a content of a structure derived from the polysiloxane (A) is 20% by mass or more and 90% by mass or less with respect to 100% by mass of the polysiloxane-polyalkylene glycol block copolymer.

Block copolymer and method of producing same, epoxy resin composition and cured product thereof, and semiconductor encapsulating material

A two-component type epoxy resin composition for a fiber reinforced composite material is a two-component type epoxy resin composition for a fiber reinforced composite material that includes the following components [A] to [C], wherein the content of the component [C] is 6 to 25 mass parts relative to 100 mass parts of the component [A]. The fiber reinforced composite material is a fiber reinforced composite material made by combining and curing the two-component type epoxy resin composition for the fiber reinforced composite material and a reinforcing fiber, [A]: an epoxy resin, [B]: an acid anhydride and [C]: a quaternary ammonium salt or a quaternary phosphonium halide or an imidazolium salt.

Two-component type epoxy resin composition for fiber-reinforced composite material, and fiber-reinforced composite material

A reinforcing fiber fabric substrate has a binder containing a thermosetting resin [A] and a curing catalyst [B] at a basis weight of 0.1 g/m2-4 g/m2 on at least the surface of a reinforcing fiber fabric constructed of reinforcing fiber strands, wherein the reinforcing fiber fabric substrate has a heating temperature (T) in the 80-180&#xb0; C. range, and the adhesive strength becomes 0.5 N/25 mm or higher at the heating temperature (T) between preform layers molded by laminating this reinforcing fiber fabric substrate at the heating temperature (T).

Reinforcing fiber fabric substrate, preform, and fiber-reinforced composite material

A method of producing a carbon nanotube-containing composition is a method of producing a carbon nanotube-containing composition for synthesizing carbon nanotube aggregates by introducing a ferrocene derivative, a sulfur compound, a carbon source, and a carrier gas into a gas phase flowing in a heating furnace within a temperature range of higher than 1,200&#xb0; C. to 1,800&#xb0; C. The carbon source substantially consists of benzene or toluene. The carrier gas includes hydrogen at 10% by volume to 85% by volume. The carrier gas has a linear velocity of 500 cm/min to 2,200 cm/min.

Method of producing carbon nanotube-containing composition

A binder resin composition for preform production includes thermosetting resin [A], thermoplastic resin [B], and curing catalyst [C], thermosetting resin [A] containing a bifunctional epoxy resin, thermoplastic resin [B] accounting for 10 to 100 parts by mass relative to 100 parts by mass of thermosetting resin [A], and curing catalyst [C] being at least one curing catalyst selected from the group consisting of organic phosphorus compounds, imidazole, and derivatives thereof.

Binder resin composition for preform, binder particle, preform, and fiber-reinforced composite material

An epoxy resin composition for RTM molding of a fiber-reinforced composite material includes [A] to [D] below, wherein [A]/[B], which is a blend mass ratio of [A] to [B], is in the range of 55/45 to 95/5: [A] a multifunctional epoxy resin that is liquid at normal temperature or has a softening point of 65&#xb0; C. or lower, the multifunctional epoxy resin being at least one selected from phenol novolac epoxy resin, cresol novolac epoxy resin, and triphenylmethane epoxy resin; [B] an alicyclic epoxy resin; [C] an acid anhydride curing agent; and [D] a curing accelerator.

Epoxy resin composition for resin transfer molding of fiber-reinforced composite material, fiber-reinforced composite material, and method for producing same

An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness.

Epoxy resin composition, prepreg and fiber-reinforced composite material

The present invention relates to an epoxy resin composition comprising the following [A], [A'], [B], and [C]: [A] a bisphenol-type epoxy resin having a glass transition temperature or melting point of 50&#xb0; C. or higher; [A&#x2032;] an epoxy resin which is in a liquid state at 25&#xb0; C.; [B] an epoxy resin curing agent; and [C] at least one block copolymer selected from the group consisting of S-B-M, B-M, and M-B-M, wherein the blocks are linked to each other by a covalent bond or by an intermediate molecule bound to one of the blocks via one covalent bond formation and to the other block via another covalent bond formation; the block M is a methyl methacrylate homopolymer or a copolymer comprising at least 50% by weight of methyl methacrylate; the block B is incompatible with the block M and has a glass transition temperature of 20&#xb0; C. or lower; and the block S is incompatible with the blocks B and M and has a glass transition temperature higher than that of the block B, a prepreg obtained by impregnating a fiber base with the epoxy resin composition, and a fiber-reinforced composite material obtained by curing the prepreg.

Epoxy resins, curing agent and (Co)poly(methyl methacrylate) block copolymer

It is an object of the present invention to provide a fiber reinforced composite material combining good properties such as toughness and impact resistance and to provide an epoxy resin composition to obtain this. This object is achieved by the an epoxy resin composition comprising the following [A], [B], [C], and [D]:

Epoxy resin composition, prepreg, and fiber reinforced composite material

It is an object of the present invention to improve drawbacks in conventional technology and provide a fiber-reinforced composite material having both an excellent static strength property and impact resistance, and an epoxy resin composition for obtaining the fiber-reinforced composite material. More particularly, it is the object of the present invention to provide the epoxy resin composition that gives a cured material having a high elastic modulus, a high heat resistance, a high plastic deformation capacity and a high toughness. The epoxy resin composition containing following [A] to [D], a prepreg obtained by impregnating a fiber substrate with the epoxy resin composition, a fiber-reinforced composite material obtained by curing the prepreg and a tubular body thereof.

Epoxy resin composition, prepreg, fiber-reinforced composite material

The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and an epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B], [C], [D], and [E]: [A] epoxy resin, [B] amine curing agent, [C] phosphorus compound, [D] curing accelerator, and [E] thermoplastic resin, wherein the resin composition has a phosphorus atom concentration of 0.2 to 15% by weight.

Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment

This invention relates to: a molding material comprising a bundle of continuous reinforcing fibers (A), a polyarylene sulfide prepolymer (B) comprising at least 50% by weight of cyclic polyarylene sulfide and having the weight average molecular weight of less than 10,000 or polyarylene sulfide (B') having the weight average molecular weight of 10,000 or greater and the degree of dispersion of 2.5 or lower, and thermoplastic resin (C); a prepreg comprising a resin composition comprising the polyarylene sulfide prepolymer (B) impregnated into a reinforcing fiber; and a method for producing a fiber-reinforced molding substrate comprising step (I) of continuously feeding a bundle of continuous reinforcing fibers, step (II) of combining cyclic polyarylene sulfide with the reinforcing fiber bundle, step (III) of heating the composite obtained in step (II) to subject the cyclic polyarylene sulfide to ring-opening polymerization to convert into polyarylene sulfide, and step (IV) of cooling the composite obtained in step (III) and withdrawing the same.

Molding material, prepreg and fiber-reinforced composite material, and method for producing fiber-reinforced molding substrate

Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.

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Nagoya, Japan

Shiro Honda