Toshiba Memory Corporation

Kabushiki Kaisha Toshiba

Shiro Harashima

Shanying Pan

Masayuki Dohi

Toshiyuki Hayakawa

Kosuke Adachi

Akinobu Hirota

According to one embodiment, a semiconductor memory device includes a casing, a substrate, a second connector, and an interposition member. The casing is provided with a first opening and includes a first edge forming the first opening. A first connector conforms to USB Type-A standard and can pass through the first opening. The interposition member is interposed between an inner surface of the casing and the second connector, is held by the inner surface, and holds the second connector.

Semiconductor memory device

According to one embodiment, an electronic device includes a substrate, a male connector, and conductive members. The substrate includes conductors on a surface of the substrate. The male connector is mounted on the substrate and insertable into a female connector complying with a USB Type-C standard. The conductive members are mounted in the male connector, each of the conductive members electrically connecting one of twenty-four terminals complying with the USB Type-C standard mounted in the female connector with one of the conductors when the male connector is inserted into the female connector, and a number of the conductive members being less than twenty-four.

Electronic device

A semiconductor storage device includes a substrate having a wiring, a first semiconductor memory, a terminal portion, a holder surrounding the terminal portion, a case, and a first plate-shaped member. The first semiconductor memory is disposed on a first principal surface of the substrate and is connected to the wiring. The terminal portion is connected to the substrate at a first end portion of the substrate and has a terminal connected to the wiring. The case houses part of the holder, the substrate, and the first semiconductor memory. Between the first principal surface and a first wall portion of the case facing the first principal surface, the first plate-shaped member is disposed. The first plate-shaped member is connected to the holder and the first principal surface on a second end portion side of the substrate, and has thermal conductivity.

Semiconductor storage device

According to one embodiment, a USB device includes a USB connector, a casing, and a holding member. The casing is provided with an opening. The holding member includes a holder, a support, and a first extension. The holder holds the USB connector. The support extends from the holder. The first extension has a protrusion, extends from the support, and is bendable. The protrusion is housed in the opening.

USB device

A slide structure comprises first and second members, a slider, a guide, and a first elastic part. The second member is movably supported by the first member. The slider is provided in one of the first member and the second member. The guide is provided in the other of the first member and the second member. The guide movably supports the slider among a first holding position, a slide section, and a second holding position. The first holding position is away or offset from a first position in a first direction. The slide section extends between the first position and a second position. The second position is distant from the first position in a second direction intersecting with the first direction. The second holding position is away or offset from the second position in the first direction.

Slide structure and electronic device

According to an embodiment, an electronic device includes a substrate, first conductors, second conductors, a connector, third conductors, an electronic component, and a first wiring. The first conductor is complied with a first USB standard. The second conductor is complied with a second USB standard. The connector is mounted on the first conductors or the second conductors. The first wiring connects one of the first conductors, one of the second conductors, and one of the third conductors.

According to an embodiment, an electronic device includes: a housing including a first face facing a first direction, a second face on an opposite side of the first face, and a third face adjacent to the first and second faces; a connector protruding from the third face; and a first cover connected to the housing, including a fourth face, and being pivotable between a first position where the fourth face faces the first direction and a second position where the fourth face faces the first face. The first cover includes a first stopper that, when the first cover pivots from the first position to the second position, contacts the connector and is elastically deformable in a direction that is a pivoting axial direction of the first cover and is a separating direction from the connector.

According to one embodiment, a memory module includes a substrate, a semiconductor memory device, a plate-form conductive member, wire, and a mold member. The substrate includes a ground terminal to which a ground potential is applied. The semiconductor memory device is provided on the substrate. The plate-form conductive member is provided on the semiconductor memory device. The wire that electrically connects the ground terminal to the plate-form conductive member. The mold member seals the semiconductor memory device on the substrate, the plate-form conductive member and the wire.

Growing community of inventors

Sagamihara, Japan

Shiro Harashima