Sekisui Chemical Co., Ltd.

Shiori Tateno

Takayuki Maeda

Kenji Yamauchi

Tasuku Yamada

Yousuke Chiba

Yukio Ochitani

Hideaki Tanaka

The present invention provides an epoxy resin composition capable of exhibiting high moisture resistance and reducing reduction in adhesion at high temperature and high humidity. Provided is an epoxy resin composition containing: a modified polyvinyl acetal resin containing a hydrogen-bonding group-containing constitutional unit; and an epoxy resin, the modified polyvinyl acetal resin having an equilibrium moisture absorption of 5 to 20% by weight as measured with an infrared moisture meter after standing at 40° C. and 90% RH for seven days.

Epoxy resin composition

The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.

Epoxy adhesive composition

The present invention provides an epoxy resin composition that is provided with flexibility to combine impact resistance and mechanical strength, while maintaining epoxy resin-specific high elastic modulus, that reduces an increase in viscosity due to mixing, and that is excellent in heat resistance, storage stability, and solvent resistance. Provided is an epoxy resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; a reactive diluent; and an epoxy resin, the epoxy resin composition having a sea-island phase separated structure after being cured.

The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.

The present invention aims to provide a modified polyvinyl acetal resin composition that is excellent in storage stability, has high strength and excellent adhesiveness, and is capable of reducing occurrence of warping or peeling when used for bonding different materials. The present invention relates to a modified polyvinyl acetal resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an imine structure, and an epoxy resin.

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Shiga, Japan

Shiori Tateno