Hitachi, Ltd.

Shinzou Oikawa

Eiji Setoyama

Shigeru Tanaka

Mitsuhiro Kamei

Sigeki Yamamura

A vacuum treatment apparatus includes a vacuum chamber having a first treatment position and at least one second treatment position where a substrate supported on a substrate stage subjected to a vacuum treatment. A drive device is operatively connected to a holding device to drive the same so that the holding device can move the substrate stage between the first and second treatment positions. The drive device is also operable to drive the holding device so that the holding device can rotate the substrate stage about the axis thereof at the first treatment position. A rotating device is provided for rotating the substrate stage about the axis thereof when the substrate stage is disposed at the second treatment position.

Vacuum treatment apparatus and vacuum treatment method

A magnetic film deposition chamber having Helmholtz coils and a preliminary chamber are connected through a gate valve. Two magnetic plates are fixed to the magnetic film deposition chamber near the both ends thereof. Substrates overlying apertures of a substrate holder are moved by a conveyer together with the substrate holder. The conveyor moves from the preliminary chamber to the film deposition chamber through the gate valve. The substrates then positioned over and between the magnetic plates and are located above the target in the magnetic film deposition chamber.

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Hitachi, Japan

Shinzou Oikawa