Matsushita Electric Industrial Co., Ltd.

Shinzo Eguchi

Akihiro Yamamoto

Kazushi Higashi

Makoto Imanishi

Takahiro Yonezawa

Shinji Kanayama

Hiroyuki Otani

Koichi Yoshida

Kouji Hirotani

Kenji Takahashi

Hiroshi Wada

Shozo Minamitani

Shuichi Hirata

Nobuhisa Watanabe

Kenji Okamoto

Osamu Nakao

Nobuhiko Muraoka

Masaru Ichihara

Makoto Akita

Takafumi Tsujisawa

Yasuhiro Kametani

To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate having a side for positioning the electronic part, a plate having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring for applying a regulating force to the regulating plate in order to press the electronic part to the plate

Bump bonding device and bump bonding method

When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed. Thus generation of defective components is prevented and a yield can be improved.

Bump joining judging device and method, and semiconductor component production device and method

To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage,for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate,having a side for positioning the electronic part, a plate,having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring,for applying a regulating force to the regulating plate in order to press the electronic part to the plate

A bump leveling method and a bump leveling apparatus in which the leveled height of bumps can be made constant and meet the change in thickness of an IC chip. A pressing force under which one bump is deformed to a prescribed height is measured. Thus, the pressing force under which a plurality of bumps can be deformed and leveled can be set. A load cell detects that a prescribed pressing force is exerted on the bumps and this pressing force is maintained, so that the plurality of bumps can be leveled up to the same prescribed height.

Bump levelling method and bump levelling apparatus

When an electronic component is picked up at an electronic component feeding part and then positioned and mounted at a predetermined mounting position on a transparent panel, mounting position marks formed at the mounting position on the transparent panel are registered with positioning marks formed on the electronic component, to thereby recognize the relative position from a surface opposite to a surface of the transparent panel where the electronic component is to be mounted, so that the position of the electronic component is corrected based on the result of the recognition before the electronic component is mounted at the predetermined mounting position on the transparent panel.

Method and apparatus for mounting electronic component

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Kyotanabe, Japan

Shinzo Eguchi