Daicel Corporation

Nichia Corporation

Shinya Yabuno

Yasunobu Nakagawa

Ryo Itaya

Shigeaki Kamuro

The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components:

Curable resin composition, cured product of same and semiconductor device

An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts.

Curable resin composition, cured product thereof, and semiconductor device

An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula:(SiO)(RSiO)(RSiO)(RSiO)wherein each Ris alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R, and a1&#x3e;0, a2&#x3e;0, a3&#x2265;0, a4&#x3e;0, 0.5&#x2264;a1/a2&#x2264;10, and a1+a2+a3+a4=1;(B) a polyorganosiloxane represented by the following average composition formula:RHSiOwherein Ris alkyl or aryl, and 0.7&#x2264;m&#x2264;2.1, 0.001&#x2264;n&#x2264;1.0, and 0.8&#x2264;m+n&#x2264;3; and(C): a hydrosilylation catalyst.

An object of the present invention is to provide a curable resin composition for forming a less tacky cured product having excellent gas barrier properties, heat resistance, light resistance, flexibility and heat shock resistance. The curable resin composition comprises the following components (A), (B), (C), and (D), wherein a content of the component (C) is 0.3 to 20 wt %, based on the total amount of the composition: (A): a polyorganosiloxane represented by an average unit formula: (SiO)(RSiO)(RSiO)(RSiO), wherein each Ris alkyl, aryl, alkenyl, etc., and a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol %, based on the total amount of R, and a1&#x3e;0, a2&#x3e;0, a3&#x2265;0, a4&#x3e;0, 0.5&#x2264;a1/a2&#x2264;10, and a1+a2+a3+a4=1;(B): a polyorganosiloxane represented by an average composition formula: RHSiOwherein Ris alkyl or aryl, and 0.7&#x2264;m&#x2264;2.1, 0.001&#x2264;n&#x2264;1.0, and 0.8&#x2264;m+n&#x2264;3;(C): a straight-chain polyorganosiloxane represented by a general formula (III-1): wherein Ris alkyl, and y is an integer of not less than 1 and not more than 100; and(D): a hydrosilylation catalyst.

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Ohtake, Japan

Shinya Yabuno