Tokyo Electron Limited

Shinya Wakamizu

Osamu Miyahara

Junichi Kitano

Keiichi Tanaka

Takashi Terada

Yasuhiro Takaki

Takashi Sasa

Hideo Shite

Daisuke Ishimaru

Katsuya Hashimoto

Kazuhiko Kimura

A treatment solution supply apparatus for supplying a treatment solution to a treatment solution discharge unit that discharges the treatment solution to a treatment body, includes: a temporary storage apparatus that temporarily stores the treatment solution supplied from a treatment solution supply source that stores the treatment solution; a filter that removes a foreign substance in the treatment solution from the temporary storage apparatus; and a pump that sends the treatment solution from which the foreign substance has been removed by the filter to the treatment solution discharge unit, wherein the temporary storage apparatus has a pressure-feeding function of pressure-feeding the treatment solution stored in the temporary storage apparatus.

Treatment solution supply apparatus

A non-transitory storage medium stores software for performing a rinsing process on a substrate, after a developing process is performed on a light-exposed pattern disposed thereon. The sequence includes throwing off a developing solution from the substrate after development; supplying a water-based cleaning liquid onto the substrate; supplying a surfactant-containing rinsing liquid onto the substrate to replace liquid remaining on the substrate with the surfactant-containing rinsing liquid; and rotating the substrate to expand and throw off the surfactant-containing rinsing liquid on the substrate.

Non-transitory storage medium for rinsing or developing sequence

A developing method is used for subjecting a light-exposed resist film disposed on a wafer W to a developing process by a developing solution and a rinsing process by a rinsing liquid. In a state where the resist film on the wafer W is wet with the developing solution or rinsing liquid before a drying process is performed on the wafer W, a chemical liquid (curing chemical liquid), which contains a resist curing aid contributory to curing of a resist film remaining on the wafer W, is supplied onto a surface of the wafer W. Then, ultraviolet rays are radiated onto a surface of the wafer to cure a resist film remaining on the wafer W by a synergistic effect of the resist curing aid and the ultraviolet rays thus radiated, so as to prevent pattern fall.

Developing method and developing apparatus

A rinsing method for performing a rinsing process on a substrate, after a developing process is performed on a light-exposed pattern disposed thereon, includes a step (STEP) of throwing off a developing solution from the substrate after development; a step (STEP) of supplying a water-based cleaning liquid onto the substrate; a step (STEP) of supplying a surfactant-containing rinsing liquid onto the substrate to replace liquid remaining on the substrate with the surfactant-containing rinsing liquid; and a step (STEP) of rotating the substrate to expand and throw off the surfactant-containing rinsing liquid on the substrate. STEPis arranged to supply the surfactant-containing rinsing liquid for a supply time of 5 seconds or less. STEPis arranged to include a first period with a lower rotation number and a second period with a higher rotation number, and to set the rotation number of the substrate in the first period to be more than 300 rpm and less than 1,000 rpm.

Rinse treatment method and development process method

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Koshi, Japan

Shinya Wakamizu