Polymatech Co., Ltd.

Shinya Tateda

Masayuki Tobita

Naoyuki Shimoyama

Tsunehisa Kimura

Masahumi Yamato

Tobita Masayuki

Junko Hosaka

Masafumi Yamato

Natsuko Ishihara

Tsuneh Isa Kimura

Disclosed is a thin key sheet in which the adhesive is prevented from being squeezed out and in which adhesive marks and bubble marks are hard to be visible. An adhesive layer is in a dot pattern formed by a plurality of dots spaced apart from each other by gaps, so when attaching a key top and a base sheet to each other through an intermediation of the adhesive layer, it is possible to allow air to escape through the gaps, and bubbles recognizable to a naked eye are not easily trapped by the interior of the adhesion layer or an interface between the adhesive layer and the key top. Further, since the adhesive layer is a screen print layer, a dimension of elements of fine pattern thereof can be on an order of microns, thereby making the fine pattern of the adhesive layer hard to be visible through the key top.

Key sheet

A thermally conductive formed article according to the present invention includes a matrix, and short carbon fibers which are present in the matrix. The short carbon fibers are oriented in a fixed direction in the matrix. A ratio I/Ibetween an intensity Iof a diffraction peak ascribable to a (110) surface of carbon and an intensity Iof a diffraction peak ascribable to a (002) surface of carbon, occurring when X-rays are irradiated onto the thermally conductive formed article along the direction of orientation of the short carbon fibers, is 10 or less.

Thermally conductive formed article and method of manufacturing the same

A thermally conductive molded article is produced by molding a conductive composition into a predetermined shape. The composition includes a polymer matrix and carbon powders. The carbon powders are obtained by graphitizing a polymeric material that has an aromatic ring on its main chain by heating. The carbon powders are aligned in a certain direction in the polymer matrix. Thus, the molded article can be produced easily and effectively that has excellent thermal conductivity in a given direction and that is suitable for use as a heat radiator, heat transfer member, or a component thereof in electronic hardware.

Thermally conductive molded article and method of making the same

The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device, power source, light source or other components used for the electric products, and an electronic component excellent in radiation.

Adhesion method and electronic component

Graphitized carbon powder are produced by carbonizing and expanding a pitch by heating to form carbonaceous foam and by graphitizing before pulverizing or graphitizing after pulverizing the carbonaceous foam. The resultant graphitized carbon powders have an interplanar spacing (d002) of graphite planes of less than 0.3370 nm. The powders preferably have an average particle size of from 2 to 200 &mgr;m. A thermally conductive composition includes the graphitized carbon powders in a matrix. The content of the powders is preferably 1 to 800 parts by weight relative to 100 parts by weight of the matrix. Thus, the graphitized carbon powders that have excellent thermal conductivity and a thermally conductive composition including such powders are provided.

Graphitized carbon fiber powder and thermally conductive composition

A method of manufacturing a heat conductive molded part having determined heat conductivity properties is provided. The method includes providing a polymer composition containing boron nitride powder. A magnetic field is impressed to the polymer composition containing boron nitride powder, field orienting the boron nitride powder in the polymer composition to a fixed direction. The polymer composition is set containing boron nitride powder with the boron nitride powder oriented in the polymer composition to the fixed direction. The polymer composition may also be provided containing a solvent. The solvent is removed after field orienting the boron nitride powder in the polymer composition to the fixed direction The composition is then set with the field oriented boron nitride powder after having removed the solvent.

Heat conductive mold and manufacturing method thereof

A thermally conductive polymer composition includes polymer matrix such as thermoplastic resin or thermoplastic elastomer and a graphitized carbon fiber which serves as a thermally conductive filler. The graphitized carbon fiber is made from a mesophase pitch. The mesophase pitch is spun, infusibilized, carbonized, pulverized, and graphitized to form powdery graphitized carbon fibers. Preferably, the graphitized carbon fibers have a diameter of 5-20 &mgr;m, an average particle size of 10-500 &mgr;m, and a density of 2.20-2.26 g/cm . The composition may be molded to form a thermally conductive molded article such as a thermally conductive sheet. The thermally conductive polymer composition and thermally conductive molded article have high thermal conductivity and transfer large amounts of heat from electric or electronic parts.

Thermally conductive polymer composition and thermally conductive molded article

A heat conductive adhesive film, wherein a magnetic field is applied to a film composition comprising boron nitride powder for orientating and solidifying the boron nitride powder in the composition in a given direction, an manufacturing method thereof, and an electronic component, characterized by that a heat radiating element and a heat conductive member are adhered by a heat conductive adhesive film wherein boron nitride powder is orientated in a given direction, presenting a high heat conductivity, an excellent heat radiation, and a good electric insulation and a high peeling-off strength.

Heat conductive adhesive film and manufacturing method thereof and electronic component

The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device , power source , light source or other components used for the electric products, and an electronic component excellent in radiation.

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Tokyo, Japan

Shinya Tateda