Renesas Electronics Corporation

Renesas Technology Corp.

Dexerials Corporation

Synaptics Corporation

Ando Electric Company

Nihon Kohden Corporation

Prime Planet Energy & Solutions, Inc.

Japan Tobacco Inc.

Pentel Kabushiki Kaisha

Tmeic Corporation

Synaptics Japan Gk

Synaptics Display Devices Gk

Canon Kabushiki Kaisha

Shinya Suzuki

Akihiko Yoshioka

Kiichi Makuta

Yuichi Nakagomi

Kazuya Hayashibe

Akihiro Shibata

Kazuhisa Higuchi

Naoki Hasegawa

Shinobu Nohtomi

Tsuyoshi Koga

Hiromichi Koide

Naoyuki Narita

Kazuo Okada

Eiji Takahashi

Kazuhiko Sato

Fumiyuki Matsumura

Toshikazu Tachibana

Kohei Ono

Hisao Nakamura

Katsumi Nakaichi

Shunsuke Tobayashi

Tatsuaki Suzuki

Hitoshi Tambo

Chihiro Nishikawa

Nobuo Yokouchi

Ryo Hanazaki

Koji Ishino

Daisuke Sumi

Satoshi Yasumura

Kiyotaka Miwa

Akira Tsujiko

Yoshitaka Iwasaki

Hiromasa Hiura

Ichiro Tano

Seiichi Hirose

Keisuke Ohara

Shigeru Ota

Masahito Fujihira

Yuki Nakatani

A non-aqueous electrolyte secondary battery comprises a positive electrode, a negative electrode, and an electrolyte solution. The positive electrode includes a positive electrode substrate and a positive electrode active material layer. The positive electrode active material layer includes a first layer and a second layer. The second layer is interposed between the positive electrode substrate and the first layer. The first layer includes a first positive electrode active material. The second layer includes a second positive electrode active material. The first positive electrode active material has a first particle size distribution based on volume. The first particle size distribution is unimodal. In the first particle size distribution, a ratio of D10 to D90 is from 0.18 to 0.52. The second positive electrode active material has a second particle size distribution based on volume. The second particle size distribution is multimodal.

Non-aqueous electrolyte secondary battery

The positive electrode active material layer is placed on a surface of the positive electrode substrate. The positive electrode active material layer includes a first layer and a second layer. The first layer is interposed between the positive electrode substrate and the second layer. The positive electrode active material layer includes a positive electrode active material, carbon black, and fibrous carbon. A mass fraction of the carbon black in the first layer is higher than a mass fraction of the carbon black in the second layer. A mass fraction of the fibrous carbon in the second layer is higher than a mass fraction of the fibrous carbon in the first layer.

There is provided a master for micro flow path creation, a transfer copy, and a method for producing a master for micro flow path creation by which transfer copies having an area with high hydrophilicity can be easily mass-produced, the master for micro flow path creation including: a base material; a main concave-convex portion provided on a surface of the base material and extending in a planar direction of the base material; and a fine concave-convex portion provided on a surface of the main concave-convex portion and having a narrower pitch than the main concave-convex portion. The fine concave-convex portion has an arithmetic average roughness of 10 nm to 150 nm and has a specific surface area ratio of 1.1 to 3.0.

Master for micro flow path creation, transfer copy, and method for producing master for micro flow path creation

A motor drive system of the embodiment includes a power converter, a state detector, a frequency calculator, a frequency correction command generator, a drive amount limiter, and a speed controller. The power converter drives a motor by PWM control. The state detector detects a drive state of the motor. The frequency calculator detects a size of a specific frequency component which fluctuates according to the drive state by using an index value indicating the drive state. The frequency correction command generator generates a correction command of a carrier frequency used for the PWM control on the basis of a detected result of periodic fluctuation of the drive state. The drive amount limiter limits a drive amount of the motor. The drive amount limiter adjusts an upper limit value of a size of a current caused to flow through windings of the motor in a direction in which the upper limit value is lowered from a predetermined upper limit current value when the carrier frequency is searched for in a direction in which the carrier frequency is increased. The speed controller generates a current reference based on a speed command value and a rotor speed of the motor according to the limitation.

Motor drive system and motor drive method

Protective shield

A flexible connector comprises a first plurality of pads disposed within an integrated circuit (IC) area, a second plurality of pads disposed in the IC area, and a plurality of through holes disposed in the IC area. The flexible connector further comprises first wiring coupled to the plurality of through holes and the first plurality of pads, and a rigidity element at least partially disposed between the plurality of through holes and the second plurality of pads.

Flexible connector for a display device

A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a technique which guarantees the flatness of a bump electrode even when wiring lies in a top wiring layer under the bump electrode, thereby improving the reliability in coupling between the bump electrode and the wiring formed on a glass substrate. Wiring, comprised of a power line or signal line, and a dummy pattern are formed in a top wiring layer beneath a non-overlap region of a bump electrode. The dummy pattern is located to fill the space between wirings to reduce irregularities caused by the wirings and space in the top wiring layer. A surface protection film formed to cover the top wiring layer is flattened by CMP.

Semiconductor device and a method of manufacturing the same

An integrated circuit (IC) chip comprises a plurality of pads and a plurality of bumps. The plurality of pads includes a first pad. The plurality of bumps is disposed on the plurality of pads. The plurality of bumps includes a first bump disposed on the first pad. The first bump as a width that is different than an exposed with of the first pad. The center of the first bump is not aligned with a center of the first pad.

IC chip layout for minimizing thermal expansion misalignment

A semiconductor device comprises a semiconductor substrate, a connection pad, and a bump. The connection pad is connected to the bump and disposed between the semiconductor substrate and the bump. The connection pad has one or more slits.

Connection pad configuration of semiconductor device

A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad. In other words, the wires are arranged in space which becomes available because the pad is small enough.

A packaging machine includes: a conveying machine that conveys a package blank for a package; a lid-side magnetizing roller that is supported so as to be able to come into contact with the lid-side magnetic region of the package blank, and so as to be rotatable when coming into contact, and has a permanent magnet which magnetizes a magnetic material of the lid-side magnetic region; and a body-side magnetizing roller that is supported so as to be able to come into contact with the body-side magnetic region of the package blank, and so as to be rotatable when coming into contact, and has a permanent magnet for magnetizing a magnetic material of the body-side magnetic region so as to form a predetermined magnetic distribution corresponding to a magnetic distribution in the lid-side magnetic region formed by the lid-side magnetizing roller.

Packaging machine for a package, and packaging method therefor

To provide a technique capable of reducing the chip size of a semiconductor chip and particularly, a technique capable of reducing the chip size of a semiconductor chip in the form of a rectangle that constitutes an LCD driver by devising a layout arrangement in a short-side direction. In a semiconductor chip that constitutes an LCD driver, input protection circuits are arranged in a lower layer of part of a plurality of input bump electrodes and on the other hand, in a lower layer of the other part of the input bump electrodes, the input protection circuits are not arranged but SRAMs (internal circuits) are arranged.

Semiconductor device

Growing community of inventors

Tokyo, Japan

Shinya Suzuki