Tokyo Electron Limited

Shinya Shimizu

Toshihiko Iijima

Hiroki Hosaka

Kaori Ishihara

A substrate transfer system includes a substrate storing apparatus for storing therein one or more substrates; at least one substrate processing apparatus for performing a predetermined processing on the substrate; and a substrate transfer apparatus for transferring the substrate by moving between the substrate storing apparatus and the substrate processing apparatus, the substrate transfer apparatus including at least one substrate transfer unit for supporting the substrate, unloading the substrate from the substrate storing apparatus or the substrate processing apparatus, and loading the substrate into the substrate storing apparatus of the substrate processing apparatus. The substrate transfer apparatus moves while supporting the substrate by the substrate transfer unit.

Substrate transfer system, substrate transfer apparatus and storage medium

A transfer method employs a transfer system including a semiconductor handling device and an automatic transfer device. The semiconductor handling device includes a first transfer mechanism and a first optically coupled parallel I/O communications interface. The automatic transfer device includes a second transfer mechanism and a second optically coupled parallel I/O communications interface. The transfer method includes a successive transfer notifying step wherein the automatic transfer device and the semiconductor handling device notify each other that a successive transfer is possible via an optical communications between the first and the second optically coupled parallel I/O communications interface in case where a plurality of objects to be processed are able to be successively transferred one by one between the first and the second transfer mechanism; and a successive transfer step wherein the objects are transferred one by one between the first and the second transfer mechanism.

Transfer system and transfer method of object to be processed

In a substrate transfer apparatus, an adaptor unitincludes a box-shaped main bodyhaving three open sides; and a plurality of stage armsdisposed in the main body, serving as substrate mounting members. Each of the stage armshas a disc-shaped wafer supporting portiondisposed at an approximately central portion of the main bodyand a flat bodydisposed in the main bodyso as not to interfere with the moving paths of transfer armsand. Formed at a connecting portion of the wafer supporting portionand the bodyare cutout portionsfor preventing interference between the stage armsand two prongs of leading end portions of the transfer armsandintroduced into the main body

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Nirasaki, Japan

Shinya Shimizu