Nitto-Denko Corporation

Sumitomo Electric Industries, Limited

Sumitomo Electric Wintec, Inc.

Renesas Electronics Corporation

Shinya Ota

Kazuhiro Fuke

Hisataka Ito

Masaaki Yamauchi

Kengo Yoshida

Yasushi Tamura

Jun Sugawara

Hidenori Onishi

Kazuaki Suzuki

Hideaki Saito

Shuhei Maeda

Shinjiro Uenishi

Satoshi Sato

Yasunari Ooyabu

Kenji Uchida

Takashi Taniguchi

Masakazu Sugimoto

Koki Hirasawa

Yuji Tada

Yasushi Inoue

Kei Nakamura

Takuji Okeyui

Naoto Konegawa

Megumu Nagasawa

Katsumi Shimada

Masayuki Kaneto

Masao Gunji

Kohei Nakamura

Yuki Shinbori

Yuji Hatanaka

Chisato Goto

Yudai Furuya

Seigou Takuwa

Takao Inoue

Hiroji Sugimoto

Hidenori Ohnishi

Kazuhiko Yoshida

An optical element-including opto-electric hybrid board includes an opto-electric hybrid board including an optical waveguide and an electric circuit board in order toward one side in a thickness direction, an optical element mounted on the electric circuit board at one side in the thickness direction of the opto-electric hybrid board, and a bonding member interposed between the optical element and the electric circuit board so as to bond the optical element to the electric circuit board. A thermal expansion coefficient of the bonding member is 80 ppm or less.

Optical element-including opto-electric hybrid board

To provide an optical waveguide having excellent adhesive properties with respect to a substrate, an epoxy resin photosensitive composition for an optical waveguide and a photosensitive film for an optical waveguide for fabricating the optical waveguide, and an opto-electric hybrid board including the optical waveguide.

Epoxy resin photosensitive composition for optical waveguide, photosensitive film for optical waveguide, optical waveguide, and opto-electric hybrid board

An insulated electrical cable includes: a conductor; and an insulating layer that is laminated on an outer peripheral surface of the conductor and includes a polyimide as a main component, wherein the insulating layer includes a plurality of pores, and wherein a porosity of the insulating layer is greater than or equal to 25% by volume and less than or equal to 60% by volume.

Insulated electrical cable

A method for producing an insulated electric wire includes a step of preparing a conductor having a linear shape; a step of forming an insulating coating so as to cover a surface on an outer peripheral side of the conductor to obtain an insulated electric wire that includes the conductor and the insulating coating covering the conductor; and a step of measuring a first electrostatic capacity between the insulated electric wire and a first electrode disposed outside in a radial direction of the insulated electric wire so as to face an outer peripheral surface of the insulated electric wire while transporting the insulated electric wire in a longitudinal direction of the conductor, and inspecting a formation state of the insulating coating, the formation state including a formation state of a defective portion in the insulating coating, on the basis of a change in the first electrostatic capacity.

Method for producing insulated electric wire, method for inspecting insulated electric wire, and apparatus for producing insulated electric wire

An insulated electric wire includes a linear conductor and one or a plurality of insulating layers formed on an outer peripheral surface of the conductor. At least one of the one or plurality of insulating layers contains a plurality of pores, outer shells are disposed on peripheries of the pores, and the outer shells are derived from shells of hollow-forming particles having a core-shell structure. A varnish for forming an insulating layer contains a resin composition forming a matrix and hollow-forming particles having a core-shell structure and dispersed in the resin composition. In the varnish, cores of the hollow-forming particles contain a thermally decomposable resin as a main component, and shells of the hollow-forming particles contain a main component having a higher thermal decomposition temperature than the thermally decomposable resin.

Insulated electric wire and varnish for forming insulating layer

An insulated wire according to one embodiment of the present invention includes a linear conductor, and one or a plurality of insulating layers that are laminated on an outer peripheral surface of the conductor, wherein at least one layer of the one or plurality of insulating layers includes a plurality of pores, and a closed porosity within the plurality of pores is 80% by volume or higher.

Insulated wire

An insulated electric wire includes a linear conductor and one or more of insulating layers formed on an outer peripheral surface of the conductor. In the insulated electric wire, at least one of the one or more of insulating layers has a plurality of pores, outer shells are disposed on peripheries of the pores, and each of the outer shells has a plurality of projections on an outer surface thereof.

Insulated electric wire and method for producing insulated electric wire

The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.

Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same

A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed.

Phosphor layer and light-emitting device

The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a silane coupling agent, in which a total content of the ingredient (C) and the ingredient (D) is from 69 to 94% by weight of the whole of the epoxy resin composition, and the ingredient (E) is contained in an amount satisfying the specific conditions.

Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device

The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; and (D) at least one antioxidant selected from the group consisting of hindered-phenol antioxidants, sulfide antioxidants and hindered-amine antioxidants.

Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device

The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the invention transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin.

Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same

The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): in which n is a positive number,

Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same

In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1: 

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Osaka, Japan

Shinya Ota