Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Shinya Ogasawara

Shingo Kage

Yukihiro Iwata

Yukihiro Araki

Nobuyuki Miroku

Makoto Iyoda

Yoshikazu Yamano

Miyoko Irikiin

Yasuhiro Miyamoto

Tomonori Mizutani

Jun Sato

Naoyuki Ito

Toshiya Senoh

Norio Fujiwara

Mitsuhisa Fujiki

Tetsuya Okana

Masahiko Kitagawa

Satoshi Yamabayashi

Takayuki Furukawa

An electronic apparatus includes a first chamber in which a heat generator is arranged and a second chamber separated with a partition from the first chamber. The electronic apparatus is provided with a first cabinet having the partition and an isolation wall that encloses to seal the first chamber, a second cabinet enclosing the second chamber and having an intake port and an exhaust port, a thermoconductive member arranged in the first chamber and connected thermally to the heat generator and to the partition, a heat collecting-radiating member arranged in the second chamber and connected thermally to the partition, and an air blower arranged in the second chamber so as to circulate the air in the second chamber.

Mobile computing device

Provided is an imaging device that does not let a user experience a sense of discomfort by touching a support attaching part. The imaging device includes: a support attaching part that is disposed on a support attaching surface and includes a screw hole; and a support attaching part cover that moves between a first position covering the support attaching part and a second position uncovering the support attaching part without generating convexness with regard to the support attaching surface. When a support is attached to the support attaching part, the support attaching part cover moves from the first position to the second position; and when the support is removed from the support attaching part, the support attaching part cover moves from the second position to the first position.

Imaging device support-attaching part cover

An imaging apparatus capable of reducing increase in the temperature of a supporting device coupling section is provided. The imaging apparatus includes a supporting device fixing portion having a screw hole to which a supporting device can be coupled, a supporting device receiving portion which has an exposed surface formed around the entrance of the screw hole and is configured to receive the supporting device, and an exterior section having an outer surface formed around an opening. The supporting device fixing portion and the supporting device receiving portion are formed as separate portions.

Imaging apparatus with supporting device having improved heat dissipation

Electronic apparatus provided with cooling structure

An imaging apparatus having a protection ring which protects a supporting device coupling section such that it is difficult for a user to touch the supporting device coupling section is provided. A supporting device can be coupled to a camera body, and the camera body includes a supporting device coupling section and a protection ring. The supporting device coupling section has a screw hole to which the supporting device can be coupled, and a supporting device coupling surface which is formed and exposed around the entrance of the screw hole. The protection ring includes a return spring which restricts the position of the protection ring, a return spring stopper which supports the return spring, and a supporting device contact surface which protrudes outward of the exposed surface formed around the entrance of the screw hole of the supporting device coupling section, in a direction toward a housing outside.

Imaging apparatus

An image pickup device includes a color separation prism composed of prism members and which separates light into color components, solid-state image sensors fixed to the prism members, respectively, image sensor boards on which the solid-state image sensors are mounted, respectively, an image control board to which image pickup signals generated by the image sensor boards, respectively, are inputted, and a flexible board which is connected to the image control board. The flexible board includes a signal transmission layer connected to each of the image sensor boards and which contains transmission paths for transmitting the image pickup signals to the image control board, and a heat radiating layer formed of a high heat conductivity material which is connected to each of the solid-state image sensors and fixed to the signal transmission layer via an insulating layer to transfer heat generated in the solid-state image sensors.

Multi-layer solid state imaging device

An image display apparatus of the present invention includes: a display device for displaying an image; a heat-receiving tube that is disposed so as to be in thermal communication with the display device and is filled with a cooling liquid; a heat-radiating tube that is provided to be continuous with the heat-receiving tube and is filled with the cooling liquid; and a transporting pump allowing the cooling liquid to circulate through the heat-receiving tube and the heat-radiating tube. When viewed from a display surface side of the display device, at least a part of the heat-radiating tube is located outside a peripheral edge of the display device and is disposed along the peripheral edge.

Image display apparatus

A heatsink structure for solid-state image sensors includes a foil-like heatsink sheet made of a high heat conductivity material. The heatsink sheet has a first fixed portion fixed to a solid-state image sensor and a second fixed portion fixed to another member. The heatsink sheet also has a plurality of cutout portions formed along directions from the first fixed portion toward the second fixed portion. Thus, the heatsink structure can cool the solid-state image sensor while reducing any external-force loads applied to the solid-state image sensor with a relatively simple structure.

Heatsink structure for solid-state image sensor

The present invention provides a disk apparatus reduced in size, thickness and weight, by reducing a space for carrying a disk and a space between the floating unit and the stationary frame for use in holding the floating unit in a floating state, as much as possible, with a simple structure. In the disk apparatus of the present invention, the floating unit held in a floating state in the stationary frame is so arranged that the roller arm can rotate itself, pressing a disk-shaped recording medium onto the disk guide provided on the stationary frame, to carry the disk-shaped recording medium to a desired position.

Disk apparatus

In a heat radiating member which has a contact portion to be put into contact with a solid-state image sensor fixed to a prism member, and a fin-like heat radiating portion for radiating heat, which has been transferred through the contact portion, into its surrounding gas, the contact portion and the heat radiating portion are formed from a foil member made of a high heat conductivity material. By mounting the heat radiating member on the solid-state image sensor, there is realized a heat radiating structure for cooling the solid-state image sensor while reducing external-force loads applied to the solid-state image sensor with a relatively simple structure.

Heat radiating structure for solid-state image sensor, and solid-state image pickup device

There is provided a disc device achieving a reduced thickness by reducing as much as possible the space required for sandwiching operation by a turn table and a clamper while assuring the space where an inserted disc is conveyed inside the device. The disc device includes: a clamper unit having a clamper for sandwiching a disc-shaped recording medium by a floating unit held via an elastic member to a fixed frame; and a disc recording/reproduction drive unit having a turn table. The disc device is configured so that when the disc-shaped recording medium is sandwiched, a part of the clamper and a part of the turn table are contained in each other.

The present invention provides a highly reliable disk apparatus which is reduced in size, thickness and weight, and which can surely prevent the double insertion of disk-shaped recording media with a simple structure to thereby prevent a contact between each of the disk-shaped recording media. In the disk apparatus of the present invention, a disk guide is rotatably held in the proximity of an opening for inserting and ejecting a disk-shaped recording medium, which is formed in the stationary frame fixed to the casing, and the disk guide leads the disk-shaped recording medium to the inserting and ejecting operations and also closes at least a part of the above opening.

The present invention provides a disk apparatus reduced in size and thickness, by reducing the size of a means which detects the insertion of a disk into the disk apparatus. In the disk apparatus of the present invention, an electric circuit board and disk insertion-detecting levers are provided on the floating unit, and the disk insertion-detecting levers are disposed in the proximity of the disk insertion/extraction port, and are pressed down and rotated by the outer edge of the inserted disk-shaped recording medium, to thereby directly drive a switch which outputs a disk detection signal to the electric circuit board.

Disk apparatus having disk insertion detecting levers disposed in plane of disk and rotatable in axial direction relative to disk

A magnetic head is manufactured by grinding a head chip ( ) with a gap depth (GD ) to remove its margin ( ) until the gap depth becomes a final gap depth (GD ). The gap depth (GD ) is 25 microns or thinner. The method increases yield and productivity in the manufacture of a high performance magnetic head with a decreased gap depth (GD ), which satisfies the standards of both the gap depth (GD ) and the distance between the head gap and the outermost point of the chip front.

Method of manufacturing magnetic head, and magnetic recording and reproducing apparatus

In processing a head unit in which a head relative height Y is Y&prime; with a grinding amount &Dgr;GD of &Dgr;GD&prime;, the relationship between distances Bo between a vertex of a curved surface as a front face of a head chip and a head gap before and after grinding the front face of the head chip and a gap depth dimension GD, is predetermined with respect to a head unit in which the head relative height is substantially equal to Y&prime;, through which Bo as the value of Bo before grinding corresponding to a target value of the value of Bo after grinding is determined and used as Bo of the head unit in which the head relative height Y is Y&prime;. Thus, grinding of the front face of the head chip is conducted after Bo corresponding to the target value is determined. Hence, a head unit with the value of Bo after grinding falling within the range of standard values can be manufactured efficiently, and accordingly the yield can be improved.

Growing community of inventors

Hyogo, Japan

Shinya Ogasawara