Sumitomo Electric Industries, Limited

Shinya Nishina

Nobuyoshi Tatoh

Daisuke Takagi

Koji Nishi

An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A packageincludes two or more units of electronic cooling elementmounted therein. Each unit of the electronic cooling element is inserted through the space between inner jutsof ceramic feedthrough of the packageand a bottom plate, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the packageoccupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.

Optical semiconductor module and method of producing the same

A hermetically sealing enclosure for housing photo-semiconductor devices that reduces the heat generated in the wiring strips at the ceramic terminal member, increases the allowable current of the wiring strips in comparison with the conventional enclosures while maintaining the low power consumption, and stabilizes the output of the device in the enclosure. A photo-semiconductor module incorporating the enclosure is also offered. The ceramic terminal member is provided with a first wiring layer that comprises a plurality of wiring strips and that penetrates through the ceramic terminal member; two second wiring layers each of which comprises at least one wiring strip, one of which is connected to the first wiring layer at the outside of the enclosure, and the other of which is connected to the first wiring layer at the inside; and at least one third wiring layer that comprises at least one wiring strip and that connects the two second wiring layers.

Hermetically sealing enclosure for housing photo-semiconductor devices and photo-semiconductor module incorporating the enclosure

A method of manufacturing an optical semiconductor module, comprising joining an electronic cooling element to a bottom plate of an optical semiconductor package and mounting an optical semiconductor element on the electronic cooling element, wherein the electronic cooling element is soldered to the bottom plate of the optical semiconductor package in a hydrogen atmosphere. The soldering in a hydrogen atmosphere prevents oxidation of a low temperature solder provided on the uppermost surfaces of the electronic cooling element and conduction of the heat at the soldered joint portion between the electronic cooling element and the optical semiconductor element is improved.

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Itami, Japan

Shinya Nishina