Denki Kagaku Kogyo Kabushiki Kaisha

Denka Company Limited

Shinya Narita

Takeshi Miyakawa

Hideki Hirotsuru

Yosuke Ishihara

Satoshi Higuma

Hideo Tsukamoto

Yoshihiko Tsujimura

A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 &#x3bc;m, and a second peak lies at 55-195 &#x3bc;m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 &#x3bc;m and the area of a volumetric distribution of particle sizes of 45-205 &#x3bc;m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.

Composite body and method for manufacturing same

An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 &#x3bc;m, and a second peak lies at 55-195 &#x3bc;m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 &#x3bc;m and the area of the volumetric distribution of grain sizes of 45-205 &#x3bc;m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

Aluminum-diamond composite, and heat dissipating component using same

A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C&#x2014;BN, silicon carbide, and alumina and have an average particle diameter of 10-100 &#x3bc;m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 &#x3bc;m, a thermal conductivity at 25&#xb0; C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150&#xb0; C. of 4&#xd7;10to 7.5&#xd7;10/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.

Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member

Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly () is bonded to a circuit board () created by forming metal circuitry () on a metal substrate () with an insulation layer () therebetween, whereas an LED chip () of the LED chip assembly and the metal circuitry () of the circuit board are connected via an electrical connection member (), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant () including fluorescent material.

Growing community of inventors

Omuta, Japan

Shinya Narita