Fujitsu Corporation

Kyushu Fujitsu Electronics Limited

Fujistsu Limited

Shinya Nakaseko

Toshimi Kawahara

Mitsunada Osawa

Hiroyuki Ishiguro

Junichi Kasai

Takashi Hozumi

Shinichirou Taniguchi

Mayumi Osumi

Yoshitugu Katoh

Masanori Onodera

Mamoru Suwa

Syuichi Monma

Yoshiyuki Yoneda

Ryuji Nomoto

Yukio Takigawa

Masaaki Seki

Shigeaki Yagi

A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.

Semiconductor device including stud bumps as external connection terminals

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding from a mounting surface of the resin package, metallic film parts provided to the resin projections, connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts, and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads.

Semiconductor device and mounting structure

A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.

Semiconductor integrated circuit device having stacked wiring and

An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.

Adhesive composition, semiconductor device using the composition and

A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

Semiconductor device and method of producing the same

Semiconductor device having resin gate hole through substrate for resin

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Kawasaki, Japan

Shinya Nakaseko