Tdk Corporation

Shinya Nakai

Taro Miura

Hideaki Ninomiya

Ryoichi Kondo

Tadao Fujii

Makoto Kobayashi

Akira Nakamura

Hajime Kato

Masashi Katsumata

Hideaki Shimoda

Hideya Matsubara

Yuichiro Okuyama

Takahide Kurahashi

Masashi Iwata

Yoshinari Yamashita

Hideaki Fujioka

Keizou Kawamura

Yoshiaki Fukumitsu

Takehiko Ishizuka

Kenta Nagai

Suguru Kondoh

Norikazu Yasuda

A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes.

High frequency module

A front end module () comprises: a triplexer () for separating the AMPS band, the PCS band and the GPS band from one another; a duplexer () for separating transmission signals and reception signals in the AMPS band from each other; and a duplexer () for separating transmission signals and reception signals in the PCS band from each other. The duplexers () each include an acoustic wave element that functions as a filter. A single multilayer substrate is used to integrate the triplexer () and the duplexers (). The triplexer () is made up of conductor layers located inside or on the surface of the multilayer substrate.

Front end module

A front end module comprises a diplexer, a first duplexer, and a second duplexer. The first duplexer is connected to the diplexer through a first high frequency switch and separates transmission signals and reception signals of the N-CDMA from each other. The second duplexer is connected to the diplexer through a second high frequency switch and separates transmission signals and reception signals of the W-CDMA from each other. Each of the duplexers includes acoustic wave elements. A single multi-layer substrate for integration is used to integrate the components of the front end module. The diplexer is made up of a conductor layer located inside or on the surface of the multi-layer substrate.

It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered. The high-frequency module according to the present invention includes a main module including a first high-frequency circuit at least a part of which is constituted by a conductive pattern built in a multi-layered substrate and a sub-module including a second high-frequency circuit, and the sub-module is inserted into a cavity formed in the main module. According to the present invention, the main module including the first high-frequency circuit and the sub-module including the second high-frequency circuit are constituted as separate components and the main module and the sub-module are integrated by inserting the sub-module into the cavity formed in the main module. Therefore, it is possible to use only a main module and sub-module that have been inspected after manufacture and found to be non-defective. Accordingly, it is possible to markedly increase the yield of the high-frequency module as a whole.

High-frequency module

A radio frequency signal output module having a power amplifier and an isolator element is provided in which a radio-frequency output stage can be largely reduced in size and thickness. The radio frequency signal output module comprises a dielectric multilayer substrate; a radio-frequency power amplifier circuit; an isolator element; an impedance matching circuit which is inserted and connected between the radio-frequency power amplifier circuit and the isolator element; and a feedback loop for controlling the gain of the radio-frequency power amplifier circuit. The radio-frequency power amplifier circuit, the isolator element, the impedance matching circuit, and the feedback loop are integrally mounted on the dielectric multilayer substrate, and the feedback loop is branched from the impedance matching circuit, and connected to the radio-frequency power amplifier circuit.

Radio frequency signal output module having radio-frequency power amplifier and isolator element

An isolator device with a built-in power amplifier includes a single dielectric multi-layered substrate, a high frequency power amplifier circuit, an isolator element, and circuit elements provided to the dielectric multi-layered substrate. The high frequency power amplifier circuit and the isolator element are connected with each other through the circuit elements and united with the single dielectric multi-layered substrate.

Isolator device with built-in power amplifier and embedded substrate capacitor

A voltage controlled oscillator including a resonator which generates an oscillation signal, a frequency of which is in response to a control signal, and an amplifier which amplifies the oscillation signal. Also included is a frequency adjusting mechanism, as well as a voltage control sensitivity mechanism. In one example, the resonator includes an input terminal to which the control signal is applied, a variable capacitance diode and a main inductor. The oscillation frequency adjusting mechanism includes a first variable capacitor, arranged in parallel with the main inductor of the resonator. In addition, the voltage control sensitivity adjusting mechanism includes a second variable capacitor arranged between the input terminal and the amplifying mechanism, and also arranged between a hot terminal of the variable capacitance diode and a hot terminal of the main inductor.

Voltage controlled oscillator and sensitivity adjustment

An object is to densify an internal conductor of a multilayer ceramic part to thereby reduce a line loss, improve operating properties such as Q value, and reduce a variation thereof. To this end, an internal conductor paste which is composed of conductor powder, preferably silver or copper powder and optionally, a glass frit is stacked with dielectric ceramic material layers and co-fired at or above the melting point of the conductor.

Multilayer ceramic parts and method for making

A multilayer band pass filter includes a zero point forming capacitor formed by a plurality of capacitors connected in series between first and second extension electrodes, and intermediate capacitors connected between each pair of adjacent series capacitors and the open end of a core conductor. Therefore, zero points can be formed at the lower and upper limits of a given band. The capacity of these capacitors is adjustable via extension electrodes which extend outside the baked ceramic casing, thereby allowing adjustment to be made to the zero point.

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Tokyo, Japan

Shinya Nakai