Ngk Spark Plug Company, Limited

Nec Electronics Corporation

Shinya Miyamoto

Katsumi Kikuchi

Satoshi Hirano

Hirokazu Honda

Tadanori Shimoto

Keiichiro Kata

Kazuhiro Baba

Rokuro Kambe

Kenichi Saita

Shinya Suzuki

Takehiro Oba

Shinji Yuri

Yoshihiro Nakano

Makoto Kume

Shingo Ito

Daisuke Yamashita

Suguru Kyoumoto

Hirohito Hashimoto

A microcomputer calculates the concentration of ammonia contained in exhaust gas. The microcomputer repeatedly obtains from a first ammonia detection section a first ammonia electromotive force EMF1 whose value changes with both the concentrations of ammonia and a flammable gas contained in the exhaust gas. The microcomputer outputs, as ammonia concentration information at the present point in time, ammonia concentration information representing the ammonia concentration at the point 0.5 sec prior to the present point in time. The microcomputer sets a rich spike flag Fs when a first ammonia electromotive force change amount &#x394;EMF1 is smaller than a value obtained by multiplying a start determination value by &#x2212;1. When the rich spike flag Fs is set, the microcomputer sets the ammonia concentration information at the present point in time to the value of the ammonia concentration information at the point immediately before the rich spike flag Fs is set.

Concentration computation apparatus

A gas sensor is provided with a metal shell protecting member formed of a material superior in heat resistance to a metal shell, whereby a high-temperature measurement target (exhaust gas) is prevented from being in direct contact with a region, of a protector internal region of the metal shell, on the front side relative to a protector opposing surface. That is, in the gas sensor, it is possible to suppress corrosion, due to high temperature, of a region, of the protector internal region of the metal shell, on the front side relative to the protector opposing surface (an inner surface and a front end surface of a protector fixing portion), while the metal shell is formed of a material (SUS430) that can be subjected to working (crimping or the like) accompanied with deformation. Therefore, heat resistance of the entire sensor can be improved.

Sensor

Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.

Component-built-in wiring board

A component built-in wiring substrate () which includes: a core substrate (); a plate-shaped component (); a resin filling portion (); and a wiring stacking portion (), wherein, when viewed from the core principal surface () side, the projected area of the mounting area () is larger than the projected area of the plate-shaped component () and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (), and wherein a value of the coefficient of thermal expansion (CTE &#x3b1;) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.

Component built-in wiring substrate and manufacturing method thereof

A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.

Multilayer wiring substrate, and method of producing same

Growing community of inventors

Kohnan, Japan

Shinya Miyamoto