Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Shinya Marumo

Yasuharu Ueno

Makoto Morikawa

Shinji Kanayama

Akira Yamada

Shozo Minamitani

Takaharu Mae

Hiroyuki Naito

Nobuhisa Watanabe

Makoto Akita

Akira Mori

Ryosuke Usui

Junichi Kimura

Shuichi Hirata

Masayuki Nagamatsu

Takafumi Tsujisawa

Tatsuya Kunisato

A semiconductor device includes a semiconductor element, a base, and an outer packaging resin. The base has a mounting surface, on which the semiconductor element is mounted, and a groove provided around the semiconductor element on the mounting surface. An outer packaging resin covers the semiconductor element and the base, and is fixed to the base by filling the groove. A bottom of the groove includes a first recess-projection having a first amplitude and a first repetition interval along an extending direction of the groove. The first recess-projection includes a second recess-projection having a second amplitude smaller than the first amplitude and a second repetition interval shorter than the first repetition interval along the extending direction of the groove.

Semiconductor device

A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

Component mounting method, component mounting apparatus, and ultrasonic bonding head

A component mounting apparatus has a stagewith a fixed height position for holding a substrate, and a mounting headthat releasably holds a component, is moved downward toward the stagefrom a first reference height position HBfixedly positioned above the stage, and mounts the held componenton the substrateor an already mounted component. A controllerhas a mounting reference height calculation unitfor calculating a mounting reference height Hcorresponding to a distance from the first reference height position HB, and a first target movement height calculation unitfor calculating a first target movement height ZTAGbased on at least the mounting reference height Hand a thickness PTof the componentheld by the mounting head. The controllermoves the mounting headholding the componentdownward from the first reference height position HBto the first target movement height ZTAGto mount the held componenton the substrateor the already mounted component

Component mounting apparatus and component mounting method

A component mounting apparatus includes a component feeder () that feeds a component () with its bump electrodes facing down, a mounting head () that mounts the component onto a substrate (), a supporting base () that secures the substrate, and a positioning device () that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (), an ultrasonic vibration propagation member () that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face () holding the component as vibration parallel thereto, a pressure loader () that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater () that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes () on its face.

Electronic component mounting method and apparatus and ultrasonic bonding head

Growing community of inventors

Osaka, Japan

Shinya Marumo