Nichia Corporation

Shinya Kondo

Takeshi Tamura

Atsushi Yamamoto

Takuya Wasa

Takenori Kumakura

Takuya Nakabayashi

A planar light source includes: a support member including a wiring substrate, a light guide member, a light source disposed in a hole of the light guide member, and a first reinforcing member disposed on the support member and surrounding the light guide member in a plan view. The first reinforcing member includes first and second portions extending in a first direction and facing each other, and includes third and fourth portions extending in a second direction orthogonal to the first direction and facing each other. At least one of the first portion, the second portion, the third portion, and the fourth portion has light reflectivity to light emitted from the light source. In the plan view, the light guide member is located between the first and second portions in the second direction, and is located between the third and fourth portions in the first direction.

Planar light source and display device

A light-emitting element includes a semiconductor layered body including an n-side semiconductor layer having a first region and second regions, a p-side semiconductor layer on the first region, and a light-emitting layer between the first region and the p-side semiconductor layer; an insulating film defining at least one p-side opening above the p-side semiconductor layer and n-side openings each defined above a corresponding second region; an n-side electrode connected to each second region at each corresponding n-side opening; and a p-side electrode electrically connected to the p-side semiconductor layer through the p-side opening. In a top view, the n-side electrode includes at least one base portion on the first region, at least one first extending portion extending in a first direction from the base portion, and at least one second extending portion extending in the first direction from the base portion.

Light-emitting element

A light-emitting device includes: a light-emitting element having an upper surface, and including a plurality of semiconductor light-emitting structures; and a substrate supporting the light-emitting element. The semiconductor light-emitting structures include a first semiconductor light-emitting structure and a second semiconductor light-emitting structure. The substrate includes: an interconnection layer including: a first interconnection portion comprising a first land, a second interconnection portion comprising a second land and a third land, and a third interconnection portion comprising a fourth land, and a first reflective member covering a portion of the interconnection layer and having an opening. The light-emitting element is located inside the opening of the first reflective member as viewed from above. A portion of the first land, a portion of the second land, a portion of the third land, and a portion of the fourth land are exposed in the opening of the first reflective member.

Light-emitting device

A light emitting device includes: a substrate; and at least one light-emitting part comprising a light source and a sealing member covering the light source, wherein the sealing member includes a dent and a peripheral portion surrounding the dent, and includes at least one projection at the peripheral portion.

Method of manufacturing light emitting device and light emitting device

A light-emitting device has a light-emitting element including first and a second semiconductor light-emitting structures, each having a first and a second electrode, and a substrate supporting the light-emitting element. The substrate has an interconnection layer having a first interconnection portion comprising a first land, a second interconnection portion comprising second and third lands, and a third interconnection portion comprising a fourth land, and a first reflective member covering a portion of the interconnection layer. A portion of the first land is coupled to the first electrode of the first semiconductor light-emitting structure. A portion of the second land and a portion of the third land are coupled to the second electrode of the first semiconductor light-emitting structure and the first electrode of the second semiconductor light-emitting structure, respectively. A portion of the fourth land is coupled to the second electrode of the second semiconductor light-emitting structure.

A method of manufacturing a light emitting device includes: providing a substrate and a plurality of light sources disposed on the substrate; and forming a plurality of sealing members, each covering a respective one of the plurality of light sources, by supplying a sealing material onto the substrate through a plurality of nozzles of a discharge device. The step of forming the plurality of sealing members includes: performing a first forming step, in which at least one of the sealing members is formed such that a portion of the sealing material is retained dangling from a respective at least one of the plurality of nozzles as at least one dangling thread portion, and successively performing a second forming step, which is started while the at least one dangling thread portion of the sealing material is retained dangling from the at least one of the plurality of nozzles of the discharge device.

Growing community of inventors

Itano-gun, Japan

Shinya Kondo