Murata Manufacturing Co., Ltd.

Shinya Kiyono

Sho Fujita

Atsushi Yamamoto

Kenji Nishiyama

Takeshi Furukawa

Koshi Himeda

Tatsuya Funaki

Tatsuya Kitamura

Chiharu Sakaki

Kinya Aoki

Yoshiaki Satake

Toshitaka Hayashi

A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

Semiconductor composite device and package board used therein

A method of manufacturing an electronic component module and the electronic component module manufactured by the manufacturing method includes bumps, each including a thicker portion having a relatively large thickness and a thinner portion having a relatively small thickness and formed on one surface of the substrate. When looking at the electronic component in a mounted state in a plan view, the thicker portion is positioned on a side of a corresponding outer terminal closer to a center of the electronic component and the thinner portion is positioned on the opposite side of the corresponding outer terminal. In the plan view, joining portions joining the outer terminals respectively to the bumps are formed such that a height of each joining portion on the opposite side is lower than a height of the joining portion on the side closer to the center of the electronic component.

Method of manufacturing electronic component module and electronic component module

An electronic component module formed with the use of a copper particle paste which can ensure that even the inner part of a joint material is sintered, where copper particles are excellent in oxidation resistance, and a joint part is provided with high joint reliability; and a method for manufacturing the module.

Electronic component module and method for manufacturing electronic component module

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Nagaokakyo, Japan

Shinya Kiyono