Renesas Electronics Corporation

Toshiba Tec Kabushiki Kaisha

Shinya Hori

Takashi Terada

Tsuyoshi Sanada

Yuji Kawamorita

Yuki Takagi

A label printer includes an under cover, a top cover, a label peel-off unit, an interfering member supporting member, an interfering member, and an interfered member. The top cover moves between a first position where the top cover is opened and a second position where the top cover is closed with respect to the under cover. The label peel-off unit moves between a third position where the label peel-off unit is opened and a fourth position where the label peel-off unit is closed with respect to the under cover. The interfering member abuts against an exterior member of the label peel-off unit. The interfered member is a part of the exterior member of the label peel-off unit, and protrudes toward an upstream side in the label conveyance direction and is at a position where the interfered member abuts against the interfering member.

Label printer

A thermal printer of an embodiment includes: a main body; an opening and closing lid; a printing portion that includes a platen and a thermal head; a locking portion locks the opening and closing lid; a detection unit that detects a predetermined pressing state between the thermal head and the platen when a sensor detects a detection target portion; a controller that prohibits printing by the printing portion when the detection unit does not detect the predetermined pressing state; and a biasing member that biases the main body and the opening and closing lid in a direction in which the main body and the opening and closing lid are separated from each other so that the sensor does not detect the detection target portion in a state where the opening and closing lid is not locked to the locking portion.

Thermal printer

A semiconductor device has a chip region including a back-side illumination type photoelectric conversion element, a mark-like appearance part, a pad electrode, and a coupling part. The mark-like appearance part includes an insulation film covering the entire side surface of a trench part formed in a semiconductor substrate. The pad electrode is arranged at a position overlapping the mark-like appearance part. The coupling part couples the pad electrode and mark-like appearance part. At least a part of the pad electrode on the other main surface side of the substrate is exposed through an opening reaching the pad electrode from the other main surface side of the substrate. The mark-like appearance part and coupling part are arranged to at least partially surround the outer circumference of the opening in plan view.

Semiconductor device and a manufacturing method thereof

A groove-type through hole passing through a silicon layer and a first interlayer insulating film is formed in a region around a chip formation region including a photodiode. In the groove-type through hole, a wall-like wall-type conductive pass-through portion corresponding to the groove-type through hole is formed. An electrode pad is in contact with the wall-type conductive pass-through portion. The electrode pad is electrically connected to a first interconnection through the wall-type conductive pass-through portion.

Growing community of inventors

Tokyo, Japan

Shinya Hori