Kabushiki Kaisha Toshiba

Nuflare Technology, Inc.

Toshiba Medical Systems Corporation

Shinya Higashi

Kenji Hirohata

Masayuki Tanaka

Junichiro Ooga

Takahiro Terada

Shiguma Kato

Takuya Matsuda

Kunihiko Suzuki

Yasuko Fujisawa

Kazuhiro Ito

Satoshi Wakai

Akira Kano

Mitsuaki Kato

Shigeo Kaminaga

Hironobu Hirata

Masayoshi Yajima

Kaori Deura

Masashi Aizawa

Yukio Ikarashi

A fluid passage structure includes a housing and first wall portions. The housing includes an outer surface located at an end of a first direction and two passages separated from each other provided inside. Each of two passages includes at least one fluid chamber, openings that open to the outer surface, and branch paths that is coupled to the fluid chamber. The fluid chambers of the two passages are arranged alternately in the first direction. The branch paths include at least one of: branch paths that couple at least one of the openings with one fluid chamber; and branch paths that couple one fluid chamber with another fluid chamber. The first wall portions are provided in the housing, face the fluid chamber, and are arranged in the first direction via the fluid chamber.

Flow passage structure and processing apparatus

According to an embodiment, a flow passage structure includes a member. The member has a surface and is provided with a first passage, a plurality of first openings, a second passage, and a plurality of second openings. The first passage includes a plurality of first closed path portions connected to each other. The first openings is connected to the first passage and is opened in the surface. The second passage includes a plurality of second closed path portions connected to each other. The second openings is connected to the second passage and is opened in the surface. The first closed path portions pass through the second closed path portions while being isolated from the second closed path portions. The second closed path portions pass through the first closed path portions while being isolated from the first closed path portions.

According to one embodiment, a film forming apparatus includes a process chamber, a placement portion, a susceptor, a cover, a gas source, a heater, and a support portion. The placement portion is provided inside the process chamber. The susceptor is held in an end portion of the placement portion and is capable of placing a substrate. The cover is capable of being placed facing the susceptor inside the process chamber. The gas source is capable of supplying a process gas between the cover and the substrate. The heater is capable of heating the substrate. The support portion is provided inside the process chamber and is capable of supporting the cover at a first position above the susceptor and is capable of separating the cover at a second position which is different from the first position.

Film forming apparatus and film forming method

An image processing apparatus according to an embodiment includes storage circuitry and processing circuitry. The storage circuitry stores therein fluid resistance data representing a correlation among a vascular shape, a blood flow rate, and a pressure loss. The processing circuitry extracts, from three-dimensional image data in which a blood vessel of a subject is rendered, vascular shape data representing a shape of the blood vessel. The processing circuitry performs fluid analysis based on the vascular shape data and the blood flow rate and the pressure loss that correspond to the vascular shape data and that are correlated by the fluid resistance data to derive a functional index related to a blood circulation state in the blood vessel of the subject.

Image processing apparatus, image processing method, and storage medium

According to an embodiment, an image analyzing device includes a first acquirer, a constructor, a first calculator, a second calculator, and a third calculator. The first acquirer is configured to acquire image information on a joint of a subject and bones connected to the joint. The constructor is configured to construct a three-dimensional shape of the bones and the joint, and relation characteristics between a load and deformation in the bones and the joint from the image information. The first calculator is configured to calculate a positional relation between the bones connected to the joint. The second calculator is configured to calculate acting force of a muscle acting on the bones connected to the joint based on the positional relation. The third calculator is configured to calculate first stress acting on the joint based on the three-dimensional shape, the relation characteristics, and the acting force.

Image analyzing device, image analyzing method, and computer program product

In accordance with the embodiment of the present invention, there is provided a susceptor which includes an annular first susceptor portion for supporting the peripheral portion of a silicon wafer and further includes a second susceptor portion provided in contact with the peripheral portion of the first susceptor portion and covering the opening of the first susceptor portion. The second susceptor portion is disposed so that, when the silicon wafer is supported on the first susceptor portion, a gap of a predetermined size is formed between the silicon wafer and the second susceptor portion, and so that another gap of a size substantially equal to the predetermined size and directly connected to the above gap is formed between the first susceptor portion and the second susceptor portion.

Susceptor, coating apparatus and coating method using the susceptor

An epitaxial wafer manufacturing apparatus including: a chamber; a gas introduction port provided in the chamber and configured to introduce a reaction gas into the chamber; a gas exhaust port provided in the chamber and configured to exhaust the reaction gas from inside the chamber; a rotating unit provided inside the chamber; a wafer holder provided in an upper portion of the rotating unit and configured to hold a wafer; and an annular flow-regulating wall being spaced from the rotating unit and the wafer holder, the annular flow-regulating surrounding the upper portion of the rotating unit and a upper portion of the wafer holder, and the annular flow-regulating expanding downward. The flow-regulating wall has an upper end being located above the wafer holder. The upper end has a smaller inner diameter than an outer periphery of the wafer holder. The flow-regulating wall has a lower end being located below an upper surface of the rotating unit. The lower end has a larger inner diameter than an outer periphery of the rotating unit.

Epitaxial wafer manufacturing apparatus and manufacturing method

A multiple power supply unit includes two DC stabilized power supplies that provide electrical power in parallel to a load, each power supply providing its own operation indication to the other power supply. Each power supply changes a reference voltage used to detect excess current of its own output to the load according to whether the operation indication is received from the other power supply.

Multiple power supply unit with improved overcurrent sensitivity

A power supply apparatus in which at least one or more DC power supply devices having impedance elements with the same impedance on output lines are parallel-connected, and supply output voltages to a common load via the impedance elements includes an external adjustment voltage supply circuit for supplying an adjustable external adjustment voltage to each DC power supply device, and an internal voltage control circuit for comparing the external adjustment voltage from the external adjustment voltage supply circuit incorporated in each DC power supply device with the voltage applied to each impedance element, and controlling the output voltage so as to make these voltages equal, thereby equalizing voltages applied to the impedance elements in the respective DC power supply devices.

Power supply apparatus for synchronizing the output voltages of a

An anode voltage of a diode for reverse current prevention provided in each power supply module is output to a current balance control terminal via a resistor. The current balance control terminals of the respective power supply modules are mutually connected, and an average level of the anode voltages in the reverse current prevention diodes of the respective power supply modules is applied to the current balance control terminals as a reference voltage level. By executing the switching control for the power MOSFET in each power supply module so as to make the anode voltage of the reverse current prevention diode in each power supply module equal to the reference voltage, the output current values of the respective power supply modules are set to be equal.

Power supply unit, parallel operation control circuit applied thereto,

A switching power source apparatus of a ringing choke converter system according to the present invention includes an amplifier for outputting a voltatge to be decreased with an increase in output voltage from a switching power source apparatus, an oscillator for generating a sawtooth wave voltage, a comparator for comparing the sawtooth wave voltage output from the oscillator with the detection output voltage from the amplifier, a first control transistor for controlling the oscillator, and a second control transistor for controlling the switching transistor. When the sawtooth wave voltage is lower than the detection output voltage, the first control transistor is turned on, and the oscillator is subsequently turned on. When the sawtooth wave voltage is higher than the detection output voltage, the second control transistor is turned on, and the switching transistor is subsequently turned on. As a result, the switching frequency is set constant by decreasing the duty ratio in the small load period.

Switching power source apparatus of ringing choke converter system

A switching control circuit has a switching control transistor between a base current path of a switching power transistor and an emitter current limiting resistor. A collector current flows through the switching control transistor in the same direction as that of an emitter current flowing through the emitter current limiting resistor when the switching power transistor is held in an ON state. The direction of a current flowing through the emitter current limiting resistor does not change even if the switching control transistor is turned on so as to turn off the switching power transistor.

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Yokohama, Japan

Shinya Higashi