Shimadzu Corporation

Shinya Hasebe

Yoshihide Magari

Syogo Hoshino

Koki Yoshida

Takanori Yoshida

Fumiaki Tanaka

Shogo Hoshino

Yoshiki Arita

Takeshi Fujii

X-ray imaging apparatus

Controller for x-ray device

Total organic carbon meter

Head-mounted display

Provided is a radiographic imaging apparatus capable of easily and properly performing a selection operation or a playback operation of the moving image and a frame feeding operation of the moving image. An operation unit is provided with a tiltable lever and a rotation input portion provided at an upper end of the lever. The image processing unit performs a selection operation or a playback operation of the moving image to be displayed on the display unit according to a tilting operation of the lever, and performs a frame feeding operation of the moving image to be displayed on the display unit according to a rotating operation of the rotation input portion.

Radiographic imaging apparatus

Provided is an X-ray fluoroscopic imaging apparatus capable of more assuredly preventing operation control not intended by an operator. A console includes a first operation lever and a second operation lever. The first operation lever includes a main body tiltable in an x-direction or a y-direction and a rotation portion rotatable about a long axis of the first operation lever. The operation of rotating C-arm about the x-axis or the y-axis is controlled by the tilting operation of the main body, and the operation of controlling the approaching movement or the separating movement of the X-ray detector is controlled depending on a rotation direction and a rotation amount of the rotation portion. The second operation lever controls the operation of translating the C-arm in the x-direction or the y-direction.

X-ray fluoroscopic imaging device

Fluoroscopy device

Emission analysis machine

Photographic platform for medical diagnosis

A heater chip () as a heat generation element is secured to the surface on the periphery of piping (). Further, a temperature sensor chip couple () is placed on the surface on the periphery of the piping (), along the direction of flow of fluid flowing in the piping (). One () of the sensor chips in the couple is placed on the upstream side of the heater chip () and the other () is placed on the downstream side of the heater chip (). The heater chip () and the temperature sensor chips () are formed in a chip type. The temperature sensor chips () as the pair are placed at positions spaced by the same distance from the heater chip ().

Thermal mass flow meter including heating element and temperature sensors formed on separate chips and secured to the outer periphery of the pipe

A piping is anchored onto the lower faces of a heater chip and temperature sensor chips by using a thermal conductive adhesive. The heater chip and the temperature sensor chips are coated with a molding resin, and thermal resistance up to an element formed inside thereof is made smallest on a lower face side.

Thermal mass flow meter having a heater and paired temperature sensor chips separately formed and mounted on the flow pipe

In a preferred embodiment, a thermal mass flow meter is provided with: a pipe arrangement that allows a fluid to flow therein, a chip-type heat-generating element that is anchored on the surface on the periphery of the pipe arrangement and used for heating the fluid in the pipe arrangement, and paired chip-type temperature sensors that are anchored at positions on the upstream side and the downstream side of the heat-generating element with the same distance apart therefrom, on the surface of the pipe arrangement, and formed as members separated from the heat-generating element. With respect to the heat-generating element and the paired temperature sensors, convex portions thereof on a side opposite to the side to be anchored onto the pipe arrangement are housed in a concave of a printed-circuit board, and terminals of the heat-generating element and the paired temperature sensors are connected to the wiring layer of the printed-circuit board, and subsequently secured to the printed-circuit board.

Electronic components packaging structure

Growing community of inventors

Kyoto, Japan

Shinya Hasebe