Nitto-denko Corporation

Dai-ichi Kogyo Seiyaku Co., Ltd.

Shinya Akizuki

Kazuhiro Ikemura

Masao Abe

Akira Ohtani

Hiroyuki Higuchi

Satoshi Ito

Keiji Nakamoto

Michio Umeda

Akihiro Naka

Takahiro Uchida

Makoto Kuwamura

Shuichi Ito

Takashi Fukushima

Minoru Ezoe

Takuya Eto

Shinichiro Sudo

Yasuhiro Umemoto

Keiko Mochizuki

Kiyoshi Saito

Eiji Toyoda

Hisataka Ito

Tsutomu Nishioka

Katsumi Shimada

Keisuke Yoshikawa

Tsuyoshi Ishizaka

Takeshi Okada

Kei Toyota

A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230&#xb0; C., and then mixing the component (A) and remaining components with the resulting mixture.

Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby

An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.

Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same

Method of producing semiconductor device and encapsulating pellet

This invention relates to a conducting organic polymer formed by doping an organic polymer with a protonic acid having a dissociation constant value pKa of less than 4.8, wherein the organic polymer has, as the main repeating unit, a compound represented by the general formula: ##STR1## wherein, m and n, respectively, show the molar fraction of the quinonediimine structural unit and phenylenediamine structural unit in the repeating unit, and 0&lt;m&lt;1, 0&lt;n&lt;1, and m+n=1; and the organic polymer is soluble in an organic solvent in the undoped state, and has an intrinsic viscosity �.eta.! of more than 0.4 dl/g measured in N-methyl-2-pyrrolidone at 30.degree. C. This invention also relates to a film formed of the conducting organic polymer and a conducting organic polymer composition.

Organic polymer, conducting organic polymer, production methods and uses

A semiconductor device comprising a semiconductor element encapsulated with a cured resin having at least two secondary differential peaks of linear thermal expansion by a thermomechanical analytical measurement, the interval between the peaks being at least 20.degree. C. The semiconductor device encapsulated with the cured resin does not cause a warp and is excellent in the TCT test characteristics and the cracking resistance.

Semiconductor device

Copolycondensation of a hydroxyl group-containing naphthalene and xylene with an aldehyde compound gives a polyhydroxy aromatic compound. The hydroxyl group-containing naphthalene comprises at least one of naphthols and dihydroxynaphthalenes. In the polyhydroxy aromatic compound, the proportions of the naphthalene unit and xylene unit are 95 to 50:5 to 50 (mole percent), and each molecule contains 2 to 20 naphthalene units. The polyhydroxy aromatic compound is useful as an epoxy resin curing agent. Reaction of the polyhydroxy aromatic compound with an epihalohydrin gives an epoxy resin. An epoxy resin composition can be prepared from the epoxy resin and a curing agent. The epoxy resin composition suited for use as an IC encapsulant gives a cured product having a high glass transition temperature, high heat stability, high mechanical strength, and low moisture absorbing ability, hence good moisture resistance, owing to the presence of xylene in its molecular skeleton, thus cracking is avoided even during soldering treatment. The composition is therefore suitable as an IC encapsulant.

Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy

Copolycondensation of .alpha.-naphthol and .beta.-naphthol with an aldehyde compound gives a poly-hydroxynaphthalene compound having an average molecular weight of 300 to 2,000. This compound is useful as a curing agent for epoxy resins and as a precursor of epoxy resins. Epoxy resin compositions include (1) compositions comprising an epoxy resin and the poly-hydroxynaphthalene compound as a curing agent and (2) compositions comprising an epoxy resin obtained by reacting the poly-hydroxynaphthalene compound with an epihalohydrin and a curing agent. The epoxy resin compositions of the invention are characterized in that the cured resins have a high glass transition temperature and high heat stability and high moisture resistance, scarcely allowing package cracking even in soldering treatment. Therefore the compositions are suited for use in encapsulating semiconductors.

Poly-hydroxynaphthalene compounds and epoxy resin composition

This invention relates to an organic polymer having, as the main repeating unit, the compound represented by the general formula: ##STR1## (wherein, m and n respectively show the molar fraction of quinonediimine structure unit and phenylenediamine structure unit in the repeating unit, and 0&lt;m&lt;1, 0&lt;n&lt;1, and m+n=1.), and soluble in an organic solvent in an undoped state, and having the intrinsic viscocity [.eta.] of more than 0.4 dl/g measured in N-methyl-2-pyrrolidone at 30.degree. C., and a conducting organic polymer formed by doping a protonic acid to such a polymer.

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Osaka, Japan

Shinya Akizuki