Nec Corporation

Shinya Akamatsu

Shinji Mine

Tetsuya Nagata

Tadao Hosaka

Hideo Sue

Masahiro Yamada

Hideki Seguchi

A card-edge board connector is provided which does not require a relay board, does not make connection of the card-edge board fixed at a certain position or does not cause a difference in propagation time of a signal even if connecting terminals of the card-edge board are disposed in two rows. The card-edge board connector includes a first connector on which a card-edge board is mounted, a second connector on which a board is mounted, a hinge for holding the first and the second connectors capable of rotational movement, and a flexible connecting board connected to between the first and the second connectors, for electrically connecting the card-edge board and the board to each other.

Card-edge board connector that electrically connects two boards

An apparatus for making an electrical connection with an electrical unit which has an edge portion and terminals disposed along the edge portion. The apparatus includes a supporting member and a connector supported by the supporting member. The connector has a body elongated in a longitudinal direction and second terminals disposed along the longitudinal direction. The connector slidably guides the edge portion of the electrical unit along the longitudinal direction to a first fully inserted position such that each one of the terminals of the connector faces respective one of the terminals of the electrical unit.

Apparatus for connecting electronic units together

Computer

In a structure for cooling an integrated circuit (IC), a hollow cylindrical member is mounted on a cold plate and receives a heat conductor therein. The heat conductor is a cylindrical member which is closed by a flat plate at one end thereof. Silicone gel fills a gap between the hollow cylindrical member and the heat conductor and allows the heat conductor to move due to the elasticity thereof. When the cold plate is fixed in place on the IC which is mounted on a printed circuit board, the heat conductor moves in matching relation to the height and inclination of the IC. As a result, the heat conductor and IC are brought into close contact with each other. A compound intervenes between the heat conductor and the IC to enhance the close contact of the heat conductor and IC.

Structure for cooling an integrated circuit

A cooling system for cooling electronic circuit components mounted on a wiring substrate includes containers placed on the respective components, and nozzles each having a central through-hole and peripheral through-holes. The outer bottom surface of each container is in good thermal contact with a corresponding electronic circuit component. Each nozzle is inserted into a corresponding container so that first ends of the central and peripheral through-holes of the nozzle are positioned within the container, while the opposite ends are positioned outside the container. The gap between the inner side wall of each container and the outer side surface of a nozzle inserted into the container is hermetically sealed by a sealing member. Liquid coolant is supplied through the central through-hole of each container into the container and then discharged through the peripheral through-holes to a location outside the container.

Growing community of inventors

Tokyo, Japan

Shinya Akamatsu