Murata Manufacturing Co., Ltd.

Shintaro Otsuka

Koichiro Kawasaki

Kazunori Inoue

Masahiro Fukushima

Hidefumi Nakanishi

Masakazu Atarashi

Yasuyuki Toyota

An insulating layer includes a cavity in a portion covering a conductive layer. A through conductor includes an insertion portion inside the cavity and a shoulder portion on a virtual boundary surface with the insertion portion when viewed in a direction parallel or substantially parallel to a main surface. The cavity is located alternately outside and inside an edge of the shoulder portion in a circumferential direction of the shoulder portion when viewed in a direction orthogonal or substantially orthogonal to the main surface. A portion between a portion of the cavity located outside the edge of the shoulder portion and the insertion portion is filled with a portion of the support when viewed in the direction orthogonal or substantially orthogonal to the main surface.

Filter device

An electronic component includes a substrate, a functional element on the substrate, a first electrode, a support body that is made of an insulator, a cover portion, a second electrode, and a projection. The first electrode is located on the substrate and connected to the functional element. The support body protrudes from the substrate and covers the first electrode. The cover portion opposes the substrate, and a hollow space is defined by the substrate, the support body, and the cover portion. The second electrode is located in a via hole extending through the support body and the cover portion and electrically connected to the first electrode. The projection is located on the first electrode in the via hole.

Electronic component and method of manufacturing electronic component

An electronic component includes a substrate, a functional element on the substrate, a support body, a covering portion, and a protective layer covering the covering portion. The support body is provided on the substrate and around a region in which the functional element is located. The covering portion faces the substrate and is supported by the support body. The substrate, the support body, and the covering portion define a hollow space. The functional element is located in the hollow space. In the support body, a surface opposite to a surface facing the substrate is a first surface, and a portion of the protective layer is in contact with the first surface of the support body without the covering portion being interposed.

Electronic component including protective layer

A electronic component includes a connection electrode on a wiring layer. An electrically conductive layer is connected to the wiring layer via the connection electrode. A protective film covers a cover portion and the electrically conductive layer. A solder bump is electrically connected to the electrically conductive layer via an opening. An alloy layer is between the solder bump and the electrically conductive layer in a thickness direction to join the solder bump to the electrically conductive layer and differs in composition and/or elements from the solder bump. The connection electrode does not overlap the solder bump. The surface of the electrically conductive layer that is located on a protective film side is in contact with the protective film between the alloy layer and an edge of the electrically conductive layer that is located on a connection electrode side.

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Nagaokakyo, Japan

Shintaro Otsuka