Sekisui Chemical Co., Ltd.

Shintaro Moriguchi

Kenji Yamauchi

Yasuyuki Ieda

Takashi Watanabe

Hiroji Fukui

Jiro Miyai

Hiroshi Hiraike

Mitsuru Tanikawa

Osamu Inui

Hiroko Kobayashi

Hiroko Miyazaki

Yoshitaka Kunihiro

Ryosuke Yamazaki

Ayuko Oki

The present invention provides a water-soluble packaging film which is capable of inhibiting roll contamination, which has favorable unwinding properties to pass through processing steps smoothly, thereby improving the productivity, and which has enhanced water solubility, chemical resistance, visibility, and packaging properties. The present invention relates to a water-soluble packaging film including: polyvinyl alcohol; a plasticizer; and starch, the starch being applied to a front surface and a rear surface of the water-soluble packaging film, the starch being applied in an amount of 0.001 to 0.10 g per 1 mof the water-soluble packaging film, the water-soluble packaging film having a contact angle with distilled water measured by the sessile-drop method of 20&#xb0; to 50&#xb0;.

Water-soluble packaging film

The present invention provides a water-soluble packaging film which is capable of packaging chemicals while maintaining appropriate flexibility without changes in the appearance or offensive odors over a long period of time, which takes much less time to dissolve in water, and which can achieve excellent water solubility, excellent visibility, and excellent chemical resistance. The present invention relates to a water-soluble packaging film containing: polyvinyl alcohol; a plasticizer; and an alkali metal, the water-soluble packaging film containing 3 to 15 parts by weight of the plasticizer based on 100 parts by weight of the polyvinyl alcohol, the water-soluble packaging film containing 0.3 to 5% by weight of the alkali metal based on 100% by weight of the water-soluble packaging film.

The present invention provides a conductive paste that has excellent printability, that can provide a printed electrode with a smooth surface, and that is excellent in storage stability. The present invention relates to a conductive paste used for formation of an electrode of a multilayer ceramic capacitor, the conductive paste including: a polyvinyl acetal resin that contains a carboxylic acid-modified polyvinyl acetal resin; an organic solvent; and a conductive powder, the polyvinyl acetal resin having an average degree of polymerization of 200 to 800, an carboxyl group content of 0.05 to 1 mol %, a hydroxy group content of 16 to 24 mol %, an acetyl group content of 0.1 to 3 mol %, and an acetoacetal group content of not more than 25 mol %, the carboxylic acid-modified polyvinyl acetal resin having at least one of a structural unit that has a carboxyl group represented by the formula (1-1) and a structural unit that has a carboxyl group represented by the formula (1-2): in the formula (1-1), Rand Reach independently representing a C0-C10 alkylene group, Xand Xeach independently representing a hydrogen atom, a metal atom, or a methyl group, in the formula (1-2), R, R, and Reach independently representing a hydrogen atom or a C1-C10 alkyl group, Rrepresenting a C0-C10 alkylene group, Xrepresenting a hydrogen atom, a metal atom, or a methyl group.

Electroconductive paste

It is an object of the present invention to provide a binder resin which, when used in an inorganic fine particle-dispersed paste composition, leaves little amount of residual carbon after sintering and can be degreased even under low temperature conditions. It is also an object of the present invention to provide a vehicle composition and an inorganic fine particle-dispersed paste composition, which are obtained by using the binder resin. The binder resin of the present invention is for use in an inorganic fine particle-dispersed paste composition containing inorganic fine particles. The binder resin contains from 5 to 55% by weight of a segment derived from methyl methacrylate, from 30 to 80% by weight of a segment derived from isobutyl methacrylate, and from 5 to 20% by weight of a segment derived from polyoxyalkylene ether monomethacrylate.

Binder resin, vehicle composition, and paste composition having inorganic microparticle dispersed therein

The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity. The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

Growing community of inventors

Shiga, Japan

Shintaro Moriguchi