Kaneka Corporation

Shintaro Miura

Toru Yoshida

Tetsuya Shibata

Jun Fukuzawa

Takema Yamaguchi

A method of producing a polypropylene resin in-mold expanded product, includes: placing polypropylene resin particles obtained from a base material resin having a melting point of 140&#xb0; C. to 150&#xb0; C., the base material resin comprising: a polypropylene resin A comprising 3 weight % to 15 weight % of 1-butene and having a melting point of 130&#xb0; C. to 140&#xb0; C.; and a polypropylene resin B having a melting point of 145&#xb0; C. to 165&#xb0; C., water, and an inorganic gas foaming agent in a pressure-resistant container, forming a mixture, dispersing the polypropylene resin particles while stirring the mixture, obtaining a dispersion liquid, increasing a temperature and a pressure in the pressure-resistant container, releasing the dispersion liquid from the pressure-resistant container into a region having a pressure lower than the pressure in the pressure-resistant container, producing expanded polypropylene resin particles; and filling a mold with the expanded polypropylene resin particles, and then heating the expanded polypropylene resin particles.

Polypropylene resin foamed particles, in-mold foam molded body of polypropylene resin, and method for manufacturing same

An expanded polyolefin resin particle is obtained by expanding a polyolefin resin particle using water and/or an inorganic gas as a foaming agent. The polyolefin resin particle includes a polyolefin resin, a product obtained by heating and kneading a mixture, and a water absorbing substance, wherein the mixture includes a first polypropylene resin, a polypropylene wax, a polyorganosiloxane including at least one silicon-atom-bound radical polymerizable functional group per molecule, and an organic peroxide.

Polyolefin resin foam particles and production method for same

Expanded polypropylene resin particles include a polypropylene resin as a base material resin, wherein the polypropylene resin has a flexural modulus of 750 MPa to 1100 MPa. The flexural modulus and a melting point of the expanded polypropylene resin particles satisfy Expression (1): [Flexural modulus (MPa)]&#x3c;31.19&#xd7;[Melting point (&#xb0; C.)]&#x2212;3500, wherein the melting point of the expanded polypropylene resin particles is a melting point of 141.5&#xb0; C. to 150.0&#xb0; C. in a second differential scanning calorimetry (DSC) curve of a second temperature increase, the second DSC curve being obtained when the expanded polypropylene resin particles are heated from 40&#xb0; C. to 220&#xb0; C. at a temperature increase rate of 10&#xb0; C./min in a first temperature increase, then cooled from 220&#xb0; C. to 40&#xb0; C. at a temperature decrease rate of 10&#xb0; C./min, and heated again from 40&#xb0; C. to 220&#xb0; C. at a temperature increase rate of 10&#xb0; C./min in the second temperature increase.

Growing community of inventors

Osaka, Japan

Shintaro Miura