Mitsubishi Denki Kabushiki Kaisha

Other

Shintaro Minami

Hiroyuki Nishimura

Hiroshi Adachi

Shigeyuki Yamamoto

Etsushi Adachi

Shigeru Harada

Kimio Hagi

Toru Tajima

Osamu Hayashi

Takayuki Nakano

Yasuhisa Tamagawa

Tetsuyuki Kurata

Hiroshi Tobimatsu

Tetsuji Sorita

Mitsuru Takashima

Hisoshi Adachi

Tooru Tazima

Masayuki Misawa

Makoto Kamozawa

An infrared transparent optical element for use as an optical window for an infrared imaging camera includes an infrared transparent substrate, an antireflection film, and a protective film of a polymer material. The infrared transparent substrate has first and second major surfaces opposite each other, and the antireflection film is disposed on each of the first and second major surfaces of the substrate. The protective film is on an outer surface of the antireflection film on the first major surface of the substrate.

Infrared transparent optical element and infrared imaging camera using the same

A method for diagnosis of components inside a turbine generator includes collecting and measuring organic substances present in a gas inside the turbine generator to obtain data (first data). Before the collecting, organic substances generated from each component inside the turbine generator due to heat, discharge, corrosion, or friction, are measured to compile data (second data). The first data is compared to the second data to determine whether the first data includes the same data as in the second data to detect deterioration of the components inside the turbine generator.

Method for diagnosis of components inside turbine generator

In a semiconductor device and a method of fabrication thereof, a resin film forms an interlayer film of the semiconductor device having a multilayer interconnection structure, and is formed by only one coating using coating liquid containing silicone ladder polymers represented by the chemical formula: (HO).sub.2 (R.sub.2 Si.sub.2 O.sub.3).sub.n H.sub.2. As a result, it is possible to improve long-term reliability of electric characteristics or the like, and simplify a process.

Semiconductor device whose flattening resin film component has a

Method of making a semiconductor device

Semiconductor device having a multilayer interconnection structure

A semiconductor device having a stress-buffering film which is effective in buffering the stress caused by a molding resin during sealing, the stress-buffering film being made of a silicone ladder resin represented by formula (I) ##STR1## wherein each end group R may be the same or different and represents a hydrogen atom or an alkyl group, each side chain R' may be the same or different and represents a cyclohexyl group, a lower alkyl group, or a photopolymerizable unsaturated group, and n is an integer of 10 or larger.

Semiconductor device comprising a semiconductor substrate, an element

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Hyogo, Japan

Shintaro Minami