Shin-Etsu Chemical Co., Ltd.

Shin-Etsu Chemical C O., Ltd.

Shinsuke Yamaguchi

Toshio Shiobara

Hideki Akiba

Tsutomu Kashiwagi

Hiroshige Okinoshima

Yoshihiro Tsutsumi

Tomoaki Nakamura

Yoshihira Hamamoto

Tsuyoshi Honda

Yuki Kudo

Tatsuya Kanamaru

Kenji Hagiwara

Saiko Akahane

Tatsuya Kanemaru

Shuichi Fujii

Provided are a heat-curable maleimide resin composition suitable for use in a substrate, and whose cured product has an excellent high-temperature property due to its high glass-transition temperature, an excellent dielectric property and an excellent dimension stability; and an uncured and cured resin films comprised of such composition, and having an excellent handling property. The heat-curable maleimide resin composition contains:

Heat-curable maleimide resin composition

The present invention provides a surface-modified glass fiber film having its surface modified by a silicon-containing compound, and a value of a common flexural rigidity of the surface-modified glass fiber film as measured by the method described in JIS R 3420 is in the range of 3 to 100 times as compared to a value of the common flexural rigidity of an unmodified glass fiber film. There can be provided a surface-modified glass fiber film having a high strength, a high heat resistance, a good dimensional stability, a good self-supporting property, a low average linear expansion coefficient, a high storage rigidity at high temperature, and an excellent surface uniformity.

Surface-modified glass fiber film

A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25&#xb0; C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.

Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipment

The present invention provides an electromagnetic wave shielding support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate having semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon, the support base-attached encapsulant including a support base having an electromagnetic wave shielding property of 20 dB or more within a range of 100 MHz to 1,000 MHz, and an encapsulant composed of a thermosetting resin layer laminated on the support base. There can be provided a support base-attached encapsulant that can collectively encapsulate a semiconductor device mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon without occurrence of warping of the substrate or the wafer, peeling of the semiconductor devices from the substrate, and breakage of the wafer even in the case that a large-diameter wafer or a large-area substrate such as inorganic, organic, or metal substrate, especially thin one, is encapsulated, and that has excellent electromagnetic wave shielding property, reliability such as heat resistance and moisture resistance after encapsulating, and extremely high versatility, mass-productivity, workability, and economical efficiency.

Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus

Support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate or semiconductor device forming surface of a wafer, containing a support base having one fibrous film or a plurality of the fibrous films being laminated, the fibrous film subjected to surface treatment with an organosilicon compound, and a resin layer of thermosetting resin formed on one surface of the support base. The support base-attached encapsulant inhibit the substrate or wafer from warping and semiconductor devices from peeling away from the substrate, and collectively encapsulate the semiconductor device mounting surface of the substrate or the semiconductor device forming surface of the wafer even when a large-diameter wafer or large-area substrate is encapsulated. The support base-attached encapsulant has uniformity and homogeneity without opening or tangle of fiber, and is excellent in reliability such as heat resistance, electrical insulation property, moisture resistance, excellent in versatility, economical efficiency, and mass-productivity.

Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus

An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40&#xb0; C. to 110&#xb0; C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40&#xb0; C. to 110&#xb0; C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 &#x3bc;m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Epoxy resin composition, die attach method using same, and semiconductor device containing cured product thereof

Adhesive composition and a method of using the same

A radiation-curable silicone rubber composition is provided which includes:

Radiation-curable silicone rubber composition

The composition comprises a (meth)acryloyloxyl group-containing organopolysiloxane having an average molecular weight of 3,000 to 100,000, in terms of polystyrene, and a photosensitizer. Such an organopolysiloxane having an average molecular weight of 3,000 or more is produced by subjecting (meth)acryloyloxypropyltrimethoxysilane and phenyltrimethoxysilane to cohydrolysis and subsequent condensation polymerization to produce a cohydrolysis-condensation polymerization product and then reacting and silylating the same product with a silylating agent such as hexamethyldisilazane. The composition containing such a high molecular weight (meth)acryloyloxyl-group-containing organopolysiloxane is excellent in sensitivity, resolution and storage stability and has little tackiness in uncured state after being coated, as well as being excellent in heat resistance after being cured. Thus, the composition is useful for photosensitive heat-resistant materials for use in semiconductor lithography and photosensitive heat-resistant materials for use in semiconductor passivation.

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Annaka, Japan

Shinsuke Yamaguchi