Tohoku Pioneer Corporation

Pioneer Corporation

Pioneer Oled Lighting Devices Corporation

Shinsuke Tanaka

Shinji Nakajima

Yuji Saito

Koji Fujita

Hirotsugi Hatakeyama

Hiroki Tan

Shuichi Seki

Satoshi Kashiwagura

Toshinao Yuki

Katsuhiro Kanauchi

Noriaki Waki

Kunihiko Shirahata

Hidetaka Ohazama

Jun Sugahara

Yusuke Nakajima

Masato Nakamura

Akihiko Numazawa

Tsuyoshi Naijo

Hiromu Nara

A light emitting apparatus () includes a substrate (), an insulating layer (), a light emitting element (), a coating film (), and a structure (). The insulating layer () is formed over one surface of the substrate (), and includes an opening (). The light emitting element () is formed in the opening (). The coating film () is formed over the one surface of the substrate (), and covers a portion of the light emitting element (), the insulating layer (), and the one surface of the substrate (). The coating film () does not cover another portion of the substrate () (for example, a portion of an end portion: hereinafter, referred to as a first portion). The structure () is located between the first portion of the substrate () and the insulating layer (). The coating film () also covers the insulating layer ().

Light emitting apparatus

Light (light (L)) at peak luminous intensity in a light distribution of a first region () of a light-irradiating surface () is sent to a first region () of a target surface () via a first region () of a reflecting surface (). Light (light (L)) at peak luminous intensity in a light distribution in a second region () of the light-irradiating surface () is sent to a second region () of the target surface () via a second region () of the reflecting surface (). An optical distance from the first region () of the light-irradiating surface () to the first region () of the target surface () via the first region () of the reflecting surface () is greater than an optical distance from the second region () of the light-irradiating surface () to the second region () of the target surface () via the second region () of the reflecting surface (). The luminous intensity of the light (L) is higher than the luminous intensity of the light (L).

Light-emitting module

A display device () includes a light-emitting device (), a reflective liquid crystal element (), and an optical member (). The light-emitting device () includes a plurality of light-emitting units () and a light-transmitting unit () located between the light-emitting units () adjacent to each other. The light-emitting device () is located between the reflective liquid crystal element () and the optical member (). The plurality of light-emitting units () emit light toward the reflective liquid crystal element (). The light emitted from the plurality of light-emitting units () is reflected by the reflective liquid crystal element (), transmitted through the light-emitting unit () of the light-emitting device (), and formed into an image by the optical member ().

Display device

A light-emitting unit () is formed over a first surface () of a substrate (). A first terminal () and a second terminal () are formed on the first surface () of the substrate (), and are electrically connected to the light-emitting unit (). A sealing layer () is formed over the first surface () of the substrate (), and seals the light-emitting unit (). In addition, the sealing layer () does not cover the first terminal () and the second terminal (). A cover layer () is formed over the sealing layer (), and is formed of a material different from that of the cover layer (). In at least a portion of a region located next to the first terminal () and a region located next to the second terminal (), a portion of an end of the cover layer () protrudes from the sealing layer ().

Light-emitting device

A light-emitting module includes a light-emitting plate including a light-irradiating surface including a plurality of striped-pattern light-emitting units, and a reflecting member including a reflecting surface to reflect light emitted from the light-irradiating surface of the light-emitting plate toward a target surface of an object. Light at a peak luminous intensity in a light distribution in a first region of the light-irradiating surface is sent to a first region of the target surface via a first region of the reflecting surface. Light at a peak luminous intensity in a light distribution in a second region of the light-irradiating surface is sent to a second region of the target surface via a second region of the reflecting surface.

A substrate () includes a resin material. A first stacked film () is configured by laminating multiple layers and is formed on a first surface () of the substrate (). A light-emitting unit () is formed over the first stacked film () and includes an organic layer. A second stacked film () is configured by laminating multiple layers and covers the light-emitting unit (). A third stacked film () is configured by laminating multiple layers and is formed on a second surface () of the substrate (). The third stacked film () is the same stacked film as the first stacked film (), and the fourth stacked film () is the same stacked film as the second stacked film ().

Light-emitting device with a sealing film

Light-emitting device with stacked layers

An organic EL element () is formed on a substrate (), and an insulating layer () surrounds the organic EL element (). A conductive layer () is located between the substrate () and the insulating layer () in a thickness direction, and is across an edge () of the insulating layer () opposite the organic EL element (). The conductive layer () includes a first layer () and a second layer (). The second layer () is formed on the first layer (). The conductive layer () does not include a portion of the second layer () in a portion overlapped with the edge () of the insulating layer ().

When a coating filmis formed on a substrateon which elementsare formed, by an ALD film forming method or the like, the coating filmis partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substratepartially with a partially coating membera step of forming the elementson the substratea step of forming the coating filmon the substrateto cover the elementsand the partially coating memberand a step of forming a crackA in the coating filmon the partially coating member

Method for manufacturing electronic device

A double-sided display device includes a pair of substrates, on which self-emitting elements are formed respectively, being bonded to each other. A lead wiring section of the self-emitting element area formed on one of the substrates and a lead wiring section of the self-emitting element area formed on the other substrate are formed on the same side of the substrates. Each of the lead wiring sections is formed in a part of the side of each of the substrates. In addition, cutout portions are formed in parts of the sides of the substrates where the lead wiring sections are not formed. Thus, in the double-sided display device, the lead wiring sections formed on ends of substrates can be easily connected with a driving circuit component, a wiring substrate or the like, while the space for the double-sided display device can be reduced.

Growing community of inventors

Yonezawa, Japan

Shinsuke Tanaka