Nikon Corporation

Shinsuke Takeda

Kazuhiko Fukazawa

Yoshihiko Fujimori

Toshihisa Tanaka

Naoshi Sakaguchi

An X-ray apparatus includes: a mounting unit upon which an object to be measured is mounted; an X-ray generation unit that irradiates X-rays, from above the mounting unit or from below the mounting unit, to the object to be measured upon the mounting unit; an X-ray detector that acquires a transmission image of the object to be measured being irradiated by the X-rays; a first movement unit that moves at least one of the mounting unit, the X-ray generation unit, and the X-ray detector along a direction of irradiation of the X-rays; a position detection unit that detects a relative position of the mounting unit, the X-ray generation unit, and the X-ray detector; and a calculation unit that calculates a magnification of a transmission image of the object to be measured acquired by the X-ray detector, in a state in which deflection of the mounting unit has occurred while the object to be measured is mounted upon the mounting unit.

X-ray apparatus and structure production method

A surface inspection apparatus includes: a detection unit configured to detect a first detection signal according to a first diffracted light beam and a second detection signal according to a second diffracted light beam; a storage unit which is configured to store a first reference data and a second reference data; and a determination unit which is configured to determine a processing condition of the pattern in the substrate as an inspection object substrate, based on consistency between the first detection signal and the first reference data, and consistency between the second detection signal and the second reference data.

Surface inspection apparatus, method for inspecting surface, exposure system, and method for producing semiconductor device

A surface inspection apparatus includes: an irradiation unit; a detection unit configured to detect a first detection signal according to a first light beam and a second detection signal according to a second light beam; a providing unit which is configured to provide a first reference data and a second reference data; and a determination unit which is configured to determine a processing condition of the pattern in the substrate as an inspection object substrate, based on consistency between the first detection signal and the first reference data, and consistency between the second detection signal and the second reference data.

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Yokohama, Japan

Shinsuke Takeda