Fuji Machine Mfg. Co., Ltd.

Fuji Machine Manufacturing Company, Limited

Fuji Corporation

Fuji Machine Mfg., Ltd.

Fuji Machine Co., Ltd.

Shinsuke Suhara

Koichi Asai

Seigo Kodama

Noriaki Iwaki

Yusuke Tsuchiya

Toshiya Ito

Hiroshi Katsumi

Takao Enomoto

Yasuo Muto

Takayoshi Kawai

Takayuki Mizuno

Jiro Kodama

Hirokazu Koike

Hirokazu Ikegami

Takeyoshi Isogai

Mamoru Tsuda

Mizuho Nozawa

Masaki Murai

Mitsutaka Inagaki

Takehisa Ishikawa

Yukio Ueno

Akiyoshi Tanaka

Takeoshi Isogai

An order processing device acquires an order request of a mounting member that is attached to mounting device and that handles a component, and component related information including information related to a component of a specific shape to be handled by the mounting member or information of a component related member that relates to a member that stores the component. Next, the order processing device outputs design data of the mounting member designed based on the acquired component related information to a customer PC of a requester. Designing of the mounting member is performed on the side of the supplier of mounting device and the design data is delivered to the requester, and the mounting member is manufactured on the requester side based on the design data using technology possessed by the requester.

Order processing device, identification information plate, and order processing method

A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.

Substrate-related-operation apparatus

Substrate-related-operation performing apparatus and substrate-related-operation performing system

In a component mounting machine including a tape feeder removing a top tape from a carrier tape of a component supply tape so as to expose a component on the carrier tape so that the component is sucked by a suction nozzle; and a waste tape collection box collecting the top tape removed from the carrier tape, a top-tape drawing member for catching and drawing out the top tape is drawably provided at a place where the top tape removed from the carrier tape is hanging down from the tape feeder into the waste tape collection box (for example, a top opening portion of the waste tape collection box).

Component mounting machine

A printed-board supporting apparatus includes a support pin that is attached to a pin-supporting table. An image of the support surface of the support pin is taken by a mark-image taking device, at a first position where a center of an image-take surface of the mark-image taking device is expected to coincide with a center of the support surface of the support pin. Another image of the support surface is taken at a second position where the center of the image-take surface is distant from the center of the support surface by a predetermined distance. At the second position, the image of the support surface is formed on the image-take surface at a position corresponding to the height of the support surface. Based on the position corresponding to the height of the support surface, the height of the support surface relative to the mark-image taking device is obtained.

Printed-board supporting apparatus

The invention improves supply of an electronic circuit components by a component tape. When a number of the components remaining in each feeder becomes equal to or smaller than a predetermined number, an operator is informed of a fact that another component tape can be connected to a currently used component tape. In response to the informed fact, the operator connects the currently used component tape as a preceding component tape to the above-described another component tape as a following tape such that a trailing end portion of the preceding component tape and a leading end portion of the following component tape are connected through a connecting tape. A connecting portion of the two connected component tapes is detected by a connecting-portion detecting device in S, and a two-dimensional code printed on the connecting tape is recognized by an ID decoder in S. Sis then implemented to determine whether each data element of the two-dimensional code corresponds to the corresponding data element of a bar code of the preceding component tape or not. If a positive decision is obtained in S, the component supply is continued. If a negative decision is obtained in S, the component supply is suspended. It is also possible to use, in place of the two-dimensional code and bar code, an information medium piece to and from which the information is writable and readable by means of a light such as laser light, or an information communication storage chip equipped with a communication portion.

Component information applying method and apparatus

In an electronic component mounting apparatus capable of replacing a component placing device with any of plural other component placing devices different in performance, the distance between the center line of a component pick-up portion of a replaced component placing device and the optical axis of a board recognizing camera is calibrated easily and precisely. A movable table is positioned so that a reference mark provided on a base frame to reside in the visual field of a component recognizing camera comes in the visual field of a board recognizing camera and that at the same time, the end of the component pick-up portion of the replaced component placing device comes in the visual filed of the component recognizing camera. The board recognizing camera is used to detect the positional relation of the optical axis thereof relative to the reference mark, while the component recognizing camera is used to detect the positional relations of the optical axis thereof relative to the reference mark and relative to the center line of the component pick-up portion. These detected positional relations are used to calculate the positional relation between the optical axis of the board recognizing camera and the center line of the component pick-up portion.

Calibration method and device in electronic component mounting apparatus

An electric-component mounting system wherein a determining device is operated for presently required operations of working devices disposed on a common main body, to determine a cycle-time-determinant working device which determines a cycle time of the system such that the cycle time is determined by a required operating time of the cycle-time-determinant working device as calculated when the presently required operation is performed at predetermined maximum acceleration and deceleration values or a predetermined maximum operating speed, and a slowdown device determines actual acceleration and deceleration values or an actual operating speed of each of non-cycle-time-determinant working device, so as to be lower than the predetermined maximum acceleration and deceleration values or operating speed thereof, such that the presently required operation of each non-cycle-time-determinant working device can be completed within the cycle time determined by the cycle-time-determinant working device.

Electric-component mounting system

An electric-component mounting system including a substrate-holding device for holding at least one circuit substrate, at least one first mounting unit and at least one second mounting unit, each of which has at least one mounting head each operable to receive a selected one of the electric components while each mounting unit is located in a component-supplying area, and to mount the electric component onto the at least one circuit substrate held by the substrate-holding device located in a component-mounting area, and a mounting-unit moving device operable to move the at least one first mounting unit and the at least one second mounting unit past each other, between the component-supplying and component-mounting areas in opposite directions, along respective two paths, without an interference between the first mounting unit and second mounting units.

A substrate holding device for holding a circuit substrate. The substrate holding device has a substrate clamping device including a receiving member and a movable member which is movable to force a portion of the circuit substrate against the receiving member, for thereby clamping the circuit substrate. At least one of the receiving member and the movable member has an elastically deformable portion provided by its contact portion which is to be brought into contact wiht the circuit substrate. The elastically deformable portion is preferably formed of a rubber or its equivalent material. The substrate holding device may have a movement-velocity reducing device which reduces the movement velocity of the movable member in a final stage of forward movement of the movable member toward the receiving member.

Substrate holding device and electric-circuit fabricating process

An electric-component mounting system including a component-holding device for holding an electric component, a board-supporting device for supporting a printed-wiring board on which the electric component is mounted, a first relative-movement device operable to move the component-holding device and the board-supporting device relative to each other in a first direction parallel to a surface of the board supported by the board-supporting device, a second relative-movement device operable to move the component-holding device and the board-supporting device relative to each other in a second direction which intersects the surface of the board; and a control device including a positioning portion operable to select one of a plurality of different control targets which is used for the first relative-movement device to establish a predetermined relative position between the component-holding device and the board-supporting device, and wherein the positioning portion selects one of the different control targets, depending upon a pattern of control of an operating speed of the first relative-movement device.

Electric-component mounting system for mounting electric component on a circuit substrate

A method of detecting a relative positioning error between a fiducial-mark imaging device and a substrate-holding device in an electric-component mounting system wherein the fiducial-mark imaging device is arranged to take an image of at least one substrate fiducial mark provided on a circuit substrate, and a positioning error of the circuit substrate as held by the substrate-holding device is detected on the basis of the image of the at least one substrate fiducial mark, so that an electric component is mounted by a mounting head onto the circuit substrate, so as to eliminate the positioning error of the circuit substrate, wherein the fiducial-mark imaging device is operated to take an image of at least one holding-device fiducial mark provided on the substrate-holding device, and the relative positioning error between the fiducial-mark imaging device and the substrate-holding device is detected on the basis of a positioning error of the image of the holding-device fiducial mark within an imaging area of the at least one fiducial-mark imaging device.

In an electric-component mounting system including an illuminating device including a light source which emits a light for illuminating an object, a camera which takes an image of the object, and a processing and controlling device which includes a data processing portion that processes image data representing the image of the object taken by the camera, at least one of the camera and the illuminating device includes a brightness controlling device which controls a brightness of an image taken by the camera, and the processing and controlling device includes a brightness detecting portion which detects a brightness of at least a portion of the image of the object taken by the camera, and a control-parameter varying portion which varies, based on the brightness detected by the brightness detecting portion, at least one control parameter of the brightness controlling device so that a brightness of at least a portion of an image taken by the camera is equal to a preset brightness.

Growing community of inventors

Kariya, Japan

Shinsuke Suhara