Fujitsu Corporation

Shinpei Ikegami

Hitoshi Suzuki

Kei Fukui

Kazuya Arai

Hideaki Yoshimura

Yasuhito Takahashi

Hnin Nway San Nang

A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device

A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

Package substrate unit and method for manufacturing package substrate unit

Growing community of inventors

Kawasaki, Japan

Shinpei Ikegami