Showa Denko K.k.

Kabushiki Kaisha Toyota Jidoshokki

Kabushiki Kaisha Toshiba Jidoshokki

Showa Denko Kabushiki Kaisha

Shinobu Yamauchi

Keiji Toh

Shintaro Nakagawa

Nobuhiro Wakabayashi

Shogo Mori

Katsufumi Tanaka

Eiji Kono

Yuichi Furukawa

Kota Otoshi

Shinobu Tamura

Naohisa Higashiyama

Hidehito Kubo

Masahiko Kimbara

Sumitaka Watanabe

Hideyasu Obara

Taizo Kuribayashi

Ryoichi Hoshino

Daisuke Mori

A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Semiconductor device

A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

Base for power module

A heat sink () for power module is capable of mounting a power device () on at least a surface of the heat sink. The heat sink includes a refrigerant passage () in which cooling medium that dissipates heat generated by the power device () flows and a corrugated fin body () arranged in the refrigerant passage (). The corrugated fin body () has crests () and troughs () that extend in the flow direction of the cooling medium, and side walls () each of which connects the corresponding one of the crests () with the adjacent one of the troughs (). Each adjacent pair of the side walls () and the corresponding one of the crests () or the corresponding one of the troughs () arranged between the adjacent side walls () form a fin (). Each of the side walls () has a louver () that operates to, at least, rotate the cooling medium flowing in the associated fin (). The heat sink () thus has a further improved heat dissipating performance.

Heat sink for power module

A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sinkfor a power module has a laminating body, a first side plateand a second side plate. The laminating bodyhas plural flow path platesformed in a plate shape in which plural groovesparallel to each other are concavely arranged on a flat joining face. Each grooveis set to a parallel flow pathparallel to a front face side by laminating each flow path plateby each joining face. A portion other than each grooveof each joining faceforms a heat transfer pathto each parallel flow pathof a laminating direction. A flow-in pathand a flow-out pathare formed in the first and second side plates. The flow-in pathand the flow-out pathare joined to side facesof the laminating body, and are communicated with each parallel flow path. The flow-in pathflows a cooling medium into each parallel flow path. The flow-out pathflows the cooling medium out of each parallel flow path. A refrigerant flow path is constructed by the flow-in path, each parallel flow pathand the flow-out path

A heat radiatorincludes an insulating substratewhose first side serves as a heat-generating-element-mounting side, and a heat sinkfixed to a second side of the insulating substrate. A metal layeris formed on the second side of the insulating substrateopposite the heat-generating-element-mounting side. A stress relaxation memberformed of a high-thermal-conduction material intervenes between the metal layerof the insulating substrateand the heat sinkand includes a plate-like bodyand a plurality of projectionsformed at intervals on one side of the plate-like body. The end faces of the projectionsof the stress relaxation memberare brazed to the metal layer, whereas the side of the plate-like bodyon which the projectionsare not formed is brazed to the heat sink. This heat radiatoris low in material cost and exhibits excellent heat radiation performance.

Heat radiator and power module

A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.

A heat exchanger for use as an evaporator includes a heat exchange core having a plurality of heat exchange tubes arranged in a left-right direction at a spacing, and a refrigerant turn tank as a lower tank disposed toward a lower end of the heat exchange core. The heat exchange tubes are inserted through respective tube insertion holes formed in the turn tank and joined to the tank. The turn tank has drain grooves each extending from a forwardly or rearwardly outer end of each of the tube insertion holes for discharging condensation water to below the turn tank therethrough. Each of the drain grooves has a bottom extending gradually downward as the bottom extends away from the tube insertion hole. the exchanger is used as the evaporator, the top surface of the turn tank can be drained of water with an improved efficiency.

Heat exchanger with drain grooves

A semiconductor moduleincludes a ceramic substrate having a front surface on which a semiconductor elementis mounted and a rear surface on the opposite side of the front surface, a front metal platejoined to the front surface, a rear metal platejoined to the rear surface, and a heat sinkjoined to the rear metal plate. The rear metal plateincludes a joint surfacethat faces the heat sink. The joint surfaceincludes a joint area and a non-joint area. The non-joint area includes recesseswhich extend in the thickness direction of the rear metal plate. The joint area of the rear metal plateis in a range from 65% to 85% of the total area of the joint surfaceon the rear metal plate. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.

Semiconductor module

An evaporatorcomprises a heat exchange corecomprising a plurality of tube groupsarranged in rows as spaced forwardly or rearwardly of the evaporator and each comprising a plurality of heat exchange tubesarranged in parallel at a spacing laterally of the evaporator, and a lower tankdisposed at a lower end of the coreand having connected thereto lower ends of the heat exchange tubesproviding the tube groups. The lower tankhas a top surface, front and rear opposite side surfacesand a bottom surface. The lower tankis provided in each of front and rear opposite side portions thereof with groovesformed between respective laterally adjacent pairs of heat exchange tubesand extending from an intermediate portion of the top surfacewith respect to the forward or rearward direction to the side surfacefor causing water condensate to flow therethrough. Each of the groovesincludes a first portionexisting on the top surfaceof the lower tank and having a bottom face which is gradually lowered from the intermediate portion of the top surfacetoward a front or rear side edge thereof. The evaporatorcan be diminished in the quantity of water condensate that will collect on the top surfaceof the lower tank

Evaporator

A semiconductor device is disclosed that includes a circuit board, a semiconductor element, a heat sink, and a stress relaxation member. The circuit board includes an insulated substrate, a metal circuit joined to one side of the insulated substrate, and a metal plate joined to the other side of the insulated substrate. The semiconductor element is joined to the metal circuit. The heat sink radiates heat generated in the semiconductor element. The stress relaxation member thermally joins the heat sink to the metal plate. The stress relaxation member is formed of a material having a high thermal conductivity. The stress relaxation member includes recesses, which curve inward from the peripheral portion of the stress relaxation member, to form stress relaxation spaces at the peripheral portion of the stress relaxation member.

Growing community of inventors

Oyama, Japan

Shinobu Yamauchi