Idemitsu Petrochemical Co., Ltd.

Idemitsu Kosan Company, Limited

Asahi Fiber Glass Company, Limited

Shinobu Yamao

Minoru Yabukami

Wataru Kosaka

Masami Mihara

Akitoshi Masuyama

Yoshihito Koyama

Toru Bando

Keiji Sekine

Shota Totsuka

Takafumi Akimoto

Shinichi Miura

Peng Zhao

Taizou Sugioka

Tohru Iwashita

Masaki Okano

Masahiro Nakamichi

Masami Sawai

Mitsutake Nakamura

Koji Hayata

Provided is a polycarbonate-polyorganosiloxane copolymer, including: a polyorganosiloxane block (A-1) including a specific structural unit; and a polycarbonate block (A-2) formed of a specific repeating unit, wherein the polycarbonate-polyorganosiloxane copolymer satisfies the following condition (A) or (B): condition (A): a hexane extraction amount of the polycarbonate-polyorganosiloxane copolymer is 150 ppm or less; and condition (B): average weights of polyorganosiloxane blocks in polycarbonate-polyorganosiloxane copolymers obtained by separating the polycarbonate-polyorganosiloxane copolymer with a gel permeation chromatograph satisfy a specific expression.

Polycarbonate/polyorganosiloxane copolymer and resin composition including said copolymer

Provided is a polycarbonate-polyorganosiloxane copolymer, including a polyorganosiloxane block (A-1) including a specific structural unit and a polycarbonate block (A-2) formed of a specific repeating unit.

Provided is a method of producing a polycarbonate-based resin composition, including mixing an aliphatic polycarbonate-based resin (A) containing a specific repeating unit (A-1), and at least one kind of aromatic thermoplastic resin (S) selected from the group consisting of an aromatic polycarbonate-based resin (B) containing a polycarbonate block formed of a specific repeating unit, an aromatic polyester-based resin (C) having a specific structural unit, and a polyarylate resin (D) having a specific structural unit in the presence of a transesterification catalyst at a temperature at which the resin components melt.

Method for producing polycarbonate resin composition

The method for producing a resin composition of the present invention includes a step of obtaining a lignin-containing solution that contains a solubilized lignin prepared through a treatment of separating lignin in a lignin-containing solution and a solvent, and a step of adding a resin to the lignin-containing solution to thereby obtain a lignin/resin-containing solution. Also, the method for producing a resin composition of the present invention includes a step of mixing the lignin/resin-containing solution with at least one solvent selected from water and a hydrocarbon having a dipole moment of 0.25 d or less. The lignin-containing resin molded article of the present invention uses the resin composition obtained according to the production method of the present invention.

Method for producing lignin-containing resin composition and lignin-containing resin molded article

Electrically conductive composition

Provided is a syndiotactic polystyrenic resin composition, of which the resin moiety comprises any of (A) a syndiotactic styrenic polymer (B) a rubber-like elastomer having affinity for the component (A), (E) a polymer having compatibility with or affinity for the component (A) and having a polar group, (F) a thermoplastic resin except (A), and (G) a polyolefin having MI of at most 25, and which contains from 10 to 350 parts by weight, relative to 100 parts by weight of the resin moiety, of (C) a fibrous filler, and from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120. Moldings of the composition have good impact resistance and warp little, still having good heat resistance and other good properties intrinsic to styrenic resins.

Styrenic resin composition and semiconductor carrier device

A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound. A still further type of the resin composition contains the polyarylene sulfide and the inorganic filler subjected to surface treatment with an epoxysilane type coupling agent.

Polyarylene sulfide resin compositions

Flame retarded polystyrenic resin composition and molded article of a

There are provided a prepreg for a printed circuit board which comprises a glass cloth impregnated with a flame retardative resin composition comprising a (A) resin composed of a (a) styrenic polymer having syndiotactic configuration, a (b) polymer having compatibility with or affinity for the component (a) and further containing polar group, and a (c) thermoplastic resin other than the components (a) and (b) and/or a rubbery elastomer; a (B) halogenated polystyrene in which the amount of halogen atoms contained in halogen compounds generated under specific conditions is at most 1000 ppm by weight; a (C) flame retardant aid; an (D) organic filler or inorganic filler; and the above glass cloth, and also a substrate for printed circuit which comprises the prepreg or a laminate comprising a plurality of the prepregs laminated on each other, at least one side of the prepreg or laminate being laminated with a metallic layer. The above substrate is greatly improved in resistance to electrolytic corrosion and imparted with high reliability, and thus can cope with high density commercial devices.

Prepreg for printed circuit board and substrate for printed circuit

Polyarylene sulfide resin composition

Polyarylenesulfide resin compositions

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Ichihara, Japan

Shinobu Yamao