Tokyo Electron Limited

Shinobu Tanaka

Mitsuhiro Sakai

Kiyohisa Tateyama

Noriyuki Anai

Hideyuki Takamori

Kengo Mizosaki

Yoichi Honda

Yuji Shimomura

Tsutae Omori

Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.

Substrate process method and substrate process apparatus

When an edge processing head is scanned in one direction, the discharge of a rinse solution from a rinse solution discharge nozzle at the front in a carrying direction is stopped, a developing solution is discharged from a developing solution discharge nozzle, and a rinse solution is discharged from a rinse solution discharge nozzle at the rear in the carrying direction. Specifically, with a developing solution being discharged to a glass substrate, the discharge of a rinse solution immediately follows the discharge of the developing solution. Thus, the edge processing of the substrate can be performed with minimal increases in the number of processes and in installation.

Substrate processing apparatus and substrate processing method

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Kumamoto-ken, Japan

Shinobu Tanaka