Showa Denko K.k.

Kabushiki Kaisha Toyota Jidoshokki

Taiyo Musen Co., Ltd.

Shinobu Tamura

Shogo Mori

Taizo Kuribayashi

Hideyasu Obara

Shinobu Yamauchi

Takayuki Matsuzawa

Keiji Toh

Takashi Hidai

[Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost. [Solution] The method of producing a heat-dissipating unitincludes: inserting pinspunched out of a second plate memberfor pins into a plurality of through-holesformed in a first plate memberfor a substrate. In the first plate member, a plurality of substrate forming portionsis provided side by side in the longitudinal direction of the first plate member. In the second plate member, a plurality of pin punch-out portionsis provided side by side in the longitudinal direction of the second plate member. The method includes: a step A of forming the through-holesin the substrate forming portionof the first plate member; a step B of subjecting the pin punch-out portionof the second plate memberto a half-punch out process to form half-punched-out pin forming portionsprotruding from one surface side of the second plate member; a step C of forming the pinsby punching out the pin forming portionsfrom the second plate memberand simultaneously inserting the pinsinto the through-holesin the first plate member; and a step D of forming a substrate by cutting the substrate forming portionwith the pinsinserted in the through-holesfrom the first plate member

Method of producing heat-dissipating unit

A cooling apparatus includes a casing including a top wall, a bottom wall, and a cooling fluid passage. A heat radiator arranged in the cooling fluid passage includes heat radiation units arranged in a vertical direction and at least one intermediate plate each of which is arranged between adjacent heat radiation units of the heat radiation units in the vertical direction. Each of the heat radiation units includes a substrate and pin fins provided on the substrate. The substrate of each of the heat radiation units and the at least one intermediate plate are spaced apart in the vertical direction. The pin fins of the adjacent heat radiation units are in thermal contact with the at least one intermediate plate. The pin fins of the uppermost and lowermost heat radiation units of the heat radiation units are in thermal contact with the top and bottom walls of the casing, respectively.

Cooling apparatus

A radiator for a liquid cooling type cooling device includes a plurality of fin plates and connecting members integrally connecting all the fin plates. The fin plate includes a vertically elongated rectangular flat plate body and narrow portions integrated with both end portions of the plate body. All the fin plates are arranged at intervals in the thickness direction of the plate body. The connecting member is formed into a corrugated shape and includes flat plate portions each integrated with the narrow portion of the plate body and arcuate portions and each connecting the adjacent flat plate portions. The plate body, the narrow portion, and the flat plate portion are equal in thickness. Both side surfaces of the plate body, both side surfaces of the narrow portion, and both side surfaces of the flat plate portion are positioned on the same plane.

Radiator for liquid cooling type cooling device and method of producing the same

Fin for heat exchanger

A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet, and an outflow pipe connected to the cooling-liquid outlet. The casing includes a cooling-liquid outflow portion, and the cooling-liquid outlet is formed in a top wall of the cooling-liquid outflow portion. The outflow pipe has a bottom wall parallel to a portion of the top wall of the cooling-liquid outflow portion where the cooling-liquid outlet is formed. The bottom wall has a through hole for communication with the cooling-liquid outlet. A guide portion is provided on a portion of an upper surface of a bottom wall of the cooling-liquid outflow portion, the portion corresponding to the cooling-liquid outlet, so as to change, toward an upward direction, the flow direction of cooling liquid flowing into the cooling-liquid outflow portion. Thus, a flow resistance which cooling liquid undergoes when flowing out of the casing can be reduced.

Liquid-cooled-type cooling device

A liquid-cooled-type cooling device includes a casing which has a cooling-liquid inlet formed at a rear end portion of the casing and a cooling-liquid outlet formed at a front end portion of the casing. A corrugated fin for forming a plurality of flow channels through which a cooling liquid flows from the rear side toward the front side is disposed within the casing to be located between the cooling-liquid inlet and the cooling-liquid outlet. A heat-generating-body mounting region is provided on an outer surface of a top wall of the casing. Projections which come into contact with front and rear end portions of the corrugated fin to thereby position the corrugated fin in the front-rear direction are provided on an inner surface of the bottom wall of the casing at positions shifted, in the left-right direction, from an inner surface region corresponding to the heat-generating-body mounting region.

A casing of a liquid-cooled-type cooling device has a peripheral wall including mutually facing right and left side walls. A cooling-liquid inlet is formed at one end of the right side wall, and a cooling-liquid outlet is formed at an end of the left side wall corresponding to the other end of the right side wall. A parallel-flow-channel section is provided within the casing to be located between the left and right side walls and between the cooling-liquid inlet and outlet and includes flow channels through which cooling liquid flows. Internal regions of the casing located upstream and downstream of the parallel-flow-channel section serve as inlet and outlet header sections, respectively. The cross-sectional area of the inlet header section reduces from the cooling-liquid inlet toward the left side wall. The outlet and inlet header sections are asymmetric in shape with respect to the width direction of the parallel-flow-channel section.

A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet. A fin for forming flow channels is disposed within the casing between the inlet and the outlet. A portion of the interior of the casing located rearward of the fin is an inlet header section, and a portion of the interior of the casing located frontward of the fin is an outlet header section. A rear side surface within the inlet header section is skewed toward the fin in a direction from the right side toward the left side. A positioning vertical surface extending straight along the left-right direction and positioning a rear end portion of the fin is provided on a lower portion of a left end portion of the rear side surface within the inlet header section. The rear end portion of the fin is in contact with the positioning vertical surface.

A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Semiconductor device

A semiconductor device is disclosed that includes a circuit board, a semiconductor element, a heat sink, and a stress relaxation member. The circuit board includes an insulated substrate, a metal circuit joined to one side of the insulated substrate, and a metal plate joined to the other side of the insulated substrate. The semiconductor element is joined to the metal circuit. The heat sink radiates heat generated in the semiconductor element. The stress relaxation member thermally joins the heat sink to the metal plate. The stress relaxation member is formed of a material having a high thermal conductivity. The stress relaxation member includes recesses, which curve inward from the peripheral portion of the stress relaxation member, to form stress relaxation spaces at the peripheral portion of the stress relaxation member.

An object of the invention is to provide a slot array antenna in which unstable factors for contact of an adjustment portion comprising a slot waveguide and a waveguide holder are removed, a number of parts is decreased to save weight, and assembly is simplified. Accordingly, this invention is to constitute a radiation portion () unitedly formed of a slot waveguide (), a flare holder (), and a supporting portion (), if necessary, further adding a screen holder () for a screen () for cross polarization suppression. Furthermore, this invention is to constitute a reinforcement feeder () unitedly formed of a feeder waveguide (), a reinforcement portion () and a reinforcement connector () in the case of an open type antenna.

Growing community of inventors

Oyama, Japan

Shinobu Tamura