Rohm Co., Ltd.

Shinobu Obata

Masaya Yamamoto

Teruhisa Sako

Yasuyuki Aritaki

Tomoharu Horio

Koji Nishi

Hideo Taniguchi

Yasuhiro Yoshikawa

Hideaki Hoki

Takafumi Katsuno

Nobuhito Kinoshita

Tomohiko Horikawa

Hiroshi Kinoshita

Masumi Okumura

Minoru Sakamoto

Takaya Nagahata

Eiji Yokoyama

Tadashi Yamamoto

Kanjou Ishibashi

Masanobu Kuboyama

Tetsuya Yamamura

Takuma Honda

Hiroshi Hashimoto

According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.

Fine wiring pattern, manufacturing method thereof, and thermal print head

The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base memberincluding a recess, a heat storage regionformed in the recess, a resistor layerformed on the base member, and an electrode layerformed on the base memberand electrically connected to the resistor layer. The resistor layerincludes a heating portionspanned between two portions of the electrode layerspaced from each other as viewed in a thickness direction Z of the base member. The heating portionis located so as to overlap the recessas viewed in the thickness direction Z. The base memberis made of a material having a thermal conductivity of 100 to 300 W/(m&#xb7;K).

Thermal print head and thermal printer

A heater (A) includes a substrate (), a heating resistor () formed on the substrate () and an electrode () electrically connected to the heating resistor () and containing a metal component. The heater (A) further includes a diffusion prevention layer () which is held in contact with at least part of the electrode () and prevents the metal component from diffusing from the electrode (). By preventing the diffusion of the metal component from the electrode () to the heating resistor (), the separation of the heating resistor () and the electrode () is prevented.

Heater and method for manufacturing the same

A heater (A) includes a substrate (), a heating resistor () formed on the substrate () and a protective film () covering the heating resistor (). The protective film () includes a crystallized glass layer () and an amorphous glass layer () covering the crystallized glass layer (). The protective film () further includes a semi-crystalline glass layer () surrounding an edge () of the crystallized glass layer (). The semi-crystalline glass layer () intervenes between the substrate () and a portion of the amorphous glass layer () that projects relative to the crystallized glass layer ().

Heater

Fine wiring pattern and composition, manufacturing method thereof, and thermal print head including fine wiring pattern

A toner-fixing heater includes a substrate elongated in a first direction, a resistor formed on the substrate, a wiring portion connected with the resistor, and a protective film covering the resistor. The resistor includes two belt-like portions elongated in the first direction and spaced away from each other in a second direction perpendicular to the first direction. The resistor or the wiring portion includes a conductive portion for passing an electric current in the second direction. The conductive portion may have an edge extending in nonparallel to the first direction and the second direction, or may include a first layer and a second layer formed on the first layer, where the first layer is closer to the substrate than the second layer, and the edges of the second layer are located inward of the edges of the first layer as viewed in the first direction.

A thermal printhead (A) according to the present invention includes a substrate () having an obverse surface on which a glaze layer () is formed, an electrode () formed on the glaze layer () and a clip connector () attached to an edge of the substrate () for connection to an external device and connected to the electrode () via solder (). An input wiring portion () as a buffer layer is provided between the glaze layer () and the electrode (), and the input wiring portion () protrudes from the electrode () at least at an end adjacent to the edge of the substrate ().

Thermal printhead

A thermal printhead (A) includes electrodes (-) embedded in a glaze layerat least at a portion laminated with a resistor (). Favorably, the portion of the electrodes (-) laminated with the resistor () is sunk to a depth causing the surfaces of the electrodes to be flush with the surface of the glaze layer. Such structure enhances the heat transfer efficiency from a heating portion () of the resistor () to a thermal recording medium, and smooth transfer of thermal recording paper.

Thermal print head and method for manufacturing the same

A thermal printhead (A) comprises an insulating substrate (), a common electrode () which is formed on the insulating substrate () and includes a plurality of comb teeth (), a plurality of individual electrodes () formed on the insulating substrate (), and a resistor layer () formed on the insulating substrate () and electrically connected to the comb teeth () and the individual electrodes (). The resistor layer () comprises a thin film, whereas the common electrode () and the individual electrodes () comprise a thick film.

Thermal printhead with a resistor layer and method for manufacturing same

A method of manufacturing a thermal print head includes a conductor layer formation step, a first measurement step, a conductor layer splitting step and a second measurement step. In the conductor layer formation step, a single conductor layer including first and second measurement points is formed on a substrate. In the first measurement step, the electrical resistance is measured in the conductor layer, between the first and the second measurement points. In the conductor layer splitting step, a predetermined portion of the conductor layer is removed, so that a first electrode including the first measurement point and a second electrode including the second measurement point are formed. In the second measurement step, the resistance between the first and the second electrodes is measured. If the conductor layer has a disconnected portion in the first measurement step, a repairing conductor is formed on the disconnected portion.

Method of making thermal print head

A thermal print head includes an insulating board (), a glaze layer () formed on the board (), a wiring pattern () formed on the glaze layer (), and an electrode () connected to the wiring pattern (). The electrode () includes a pad () provided on the wiring pattern (), and an upper layer () formed on the pad (). The upper layer () has a higher solderability than the pad () while also having a smaller surface area than the pad ().

Thermal print head

The thermal printhead according to the present invention includes an elongated rectangular substrate including an attaching surface and a non-attaching surface, and a heat sink plate attached to the attaching surface of the substrate. The non-attaching surface of the substrate is provided with a common electrode, a plurality of individual electrodes and a heating resistor. The heating resistor is covered with an insulating protective layer and an opaque conductive protective layer. The thermal printhead includes a positioning indicia. In the method of making the thermal printhead according to the present invention, an image of the positioning indicia is taken by an image pick-up device and imaged on a display of a monitor. Two reference lines are set on the display of the monitor. Positioning of the substrate relative to the heat sink plate is performed by moving the substrate so that the reference line of the positioning indicia coincides with the reference line on the display of the monitor.

Thermal printhead and method of making the same

A thick-film thermal printhead comprises: an oblong rectangular substrate ( ) having at least one longitudinal edge ( ); a partial glaze layer provided on the substrate along the longitudinal edge; a linear heating resistor ( ) formed on the partial glaze layer; a common electrode ( ) formed on the substrate and electrically connected to the heating resistor; and a plurality of individual electrode ( ) formed on the substrate and electrically connected to the heating resistor. The common electrode includes a plurality of comb-like teeth ( A). Each of the comb-like teeth includes a tip portion ( ) having a smaller width and a base portion ( ) having a larger width. Each of the individual electrodes includes a tip portion ( ) having a smaller width and an intermediate portion ( ) having a larger width.

Thick-film thermal printhead

A thermal printhead includes a primary substrate upon which a heating resistor, drive ICs, etc. are provided. The printhead also includes a secondary substrate for carrying e.g. a connector for a flexible cable. A plurality of clip pins are used for establishing electrical connection between the two substrates. Each clip pin is provided with a straight lead portion which is formed with a bend-facilitating part disposed between relatively rigid parts.

Growing community of inventors

Kyoto, Japan

Shinobu Obata