Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Shinobu Masuda

Yuta Moriura

Yui Sawada

Keiji Noine

Tetsuyoshi Ogura

Kenichi Ezaki

Hironobu Ukitsu

Koichi Hirano

Takeshi Suzuki

Takashi Matsumoto

Mitsutaka Matsumoto

Hiroyuki Furuya

Kenichi Ono

Akihiro Odagawa

Satoru Tomekawa

Yukihiro Ishimaru

Seiji Yamahira

Susumu Uragami

Tsukasa Shiraishi

Seiichi Hatakenaka

Kazuya Niki

Provided is a pressure-sensitive element having more sufficient expandability, a relatively wide measurement range of pressure force, and a relatively simple structure, and an electronic device using the pressure-sensitive element. The pressure-sensitive element includes a plurality of first electrodes being elongated in first direction, arranged in a first plane, and including a conductive elastic body, a plurality of second electrodes being elongated in second direction intersecting the first direction, arranged in a second plane facing the first plane, and including a conductor wire, and a plurality of dielectrics covering a surface of the plurality of second electrodes. The plurality of second electrodes have bent parts K arranged periodically, and capacitance at intersections of the plurality of first electrodes and the plurality of second electrodes changes in accordance with pressure force applied between the plurality of first electrodes and the plurality of second electrodes.

Pressure-sensitive element having sufficient expandability, a wide measurement range of pressure force, and a simple structure, and an electronic device using the pressure-sensitive element

Provided is a pressure-sensitive element having a relatively wide measurement range of a pressing force and a relatively simple structure while having more sufficient stretchability. A pressure-sensitive element includes a base material, a plurality of conductor wires, a plurality of dielectrics, and a filamentous member. The base material includes an elastic conductor having elasticity and conductivity. Further, the base material has a sheet shape. The plurality of conductor wires are arranged in parallel so as to individually intersect with the elastic conductor in plan view. Further, each of the plurality of conductor wires has a plurality of inflection parts. The plurality of dielectrics are arranged between the elastic conductor and the plurality of conductor wires. The filamentous member elongates so as to intersect with the plurality of conductor wires in plan view. Further, the filamentous member sews the plurality of conductor wires to the base material.

Pressure-sensitive element

A food management system that manages food items in a refrigerator includes: a pressure-sensitive sensor that acquires information including shapes, weights, and positions of the food items; a comparator that performs comparison of the information acquired at different times; and an identifier that identifies at least one of (i) fluctuations in the number of food items or (ii) presence or absence of the food items.

Food management system

The present invention provides a secondary battery in which effective utilization of the installation space for a pressure sensitive sensor and a heater is more sufficiently achieved and high rate deterioration and electrolytic solution deterioration can be more sufficiently detected. The present invention relates to a secondary battery including: one or more battery cells; a case for housing the battery cells; and a heater provided between a battery cell in contact with the case and the case and/or between two battery cells adjacent to each other among the battery cells, in which the heater serves as a pressure sensitive sensor that detects a pressure distribution between the battery cell in contact with the case and the case and/or between the two battery cells adjacent to each other.

Secondary battery

The present disclosure has an object of providing a tactile sensor having a simple structure and capable of detecting a shear force, and a tactile sensor unit constituting the tactile sensor. The present disclosure relates to a tactile sensor unit including: a plurality of pressure-sensitive elements each including a first substrate including a first electrode, a second electrode disposed facing the first electrode, and a dielectric disposed between the first electrode and the second electrode; and an external force acting portion disposed on and across the plurality of pressure-sensitive elements, wherein, when a shear force is applied to the external force acting portion, at least a part of the pressure-sensitive elements change in inter-electrode electrostatic capacitance.

Tactile sensor, and tactile sensor unit constituting tactile sensor

The present disclosure provides a pressure-sensitive element having a relatively wide pressing force measurement range and a relatively simple structure. Pressure-sensitive element is provided with pressure-sensitive part that receives pressing force and detector that detects the pressing force, and has a structure described below. That is, pressure-sensitive part has first conductive member that has elasticity, second conductive member, and dielectric body. Dielectric body is disposed between first conductive member and second conductive member, and at least partially covers the surface of first conductive member or second conductive member. Detector detects pressing force based on a variation in electrostatic capacitance between first conductive member and second conductive member.

Pressure-sensitive element and steering device

A pressure sensing element according to one aspect of the present disclosure includes a first electrode including at least one protrusion, a second electrode facing the at least one protrusion, and a dielectric disposed between the first electrode and the second electrode. The dielectric includes a first dielectric and a second dielectric. The first dielectric is disposed between a top of the at least one protrusion and the second electrode, and is in contact with each of the top of the at least one protrusion and the second electrode. The second dielectric is disposed between a first portion of the first electrode and the first dielectric. The first portion does not include the at least one protrusion. The at least one protrusion has a higher elastic modulus than the first dielectric.

Pressure sensing element including electrode having protrusion

A pressure sensor according to an aspect of the present disclosure includes: a first pressure sensitive element including a first conductive layer including first projections having conductivity, first wiring layers, and a first dielectric layer provided between the first projections and the first wiring layers; and a second pressure sensitive element including a second conductive layer including second projections having conductivity, second wiring layers, and a second dielectric layer provided between the second projections and the second wiring layers. The first pressure sensitive element and the second pressure sensitive element are stacked on each other.

Pressure sensor comprising first pressure sensitive element and second pressure sensitive element

A pressure sensing element of an aspect of the present disclosure includes a first electrode including at least one protrusion having elasticity; a second electrode facing the at least one protrusion; and a dielectric disposed between the first electrode and the second electrode and including a first dielectric and a second dielectric. The first dielectric is disposed between a top of the at least one protrusion and the second electrode, and is in contact with each of the top of the at least one protrusion and the second electrode. The second dielectric is disposed between a first portion of the first electrode, the first portion not including the at least one protrusion, and the first dielectric.

Pressure sensing element comprising electrode including protrusion having elasticity

There is provided a method for manufacturing a flexible semiconductor device. The method of the flexible semiconductor device according to the present invention comprises the steps of: (i) forming an insulating layer on one of principal surfaces of a metal foil; (ii) forming a semiconductor layer on the insulating layer, and then forming source and drain electrodes so that the source and drain electrodes contact with the semiconductor layer; (iii) forming a flexible film layer so that the flexible film layer covers the semiconductor layer and the source and drain electrodes; (iv) forming vias in the flexible film layer, and thereby a semiconductor device precursor is provided; and (v) subjecting the metal foil to a processing treatment, and thereby forming a gate electrode from the metal foil, wherein, in the step (v) of the processing treatment of the metal foil, the gate electrode is formed in a predetermined position by using at least one of the vias of the semiconductor device precursor as an alignment marker.

Flexible semiconductor device, method for manufacturing the same, image display device using the same and method for manufacturing the image display device

There is provided a method for manufacturing a flexible semiconductor device. The manufacturing method of the flexible semiconductor device of the present invention comprising the steps of: forming a gate electrode; forming a gate insulating film so that the gate insulating film contacts with the gate electrode; forming a semiconductor layer on the gate insulating film such that the semiconductor layer is opposed to the gate electrode; forming source and drain electrodes so that the source and drain electrodes contact with the semiconductor layer; forming a flexible film layer so that the flexible film layer covers the semiconductor layer and the source and drain electrodes; forming vias in the flexible film layer; forming a first metal layer by disposing a metal foil onto the flexible film layer, and thereby a semiconductor device precursor is provided; and subjecting the first metal layer to a processing treatment to form a wiring from a part of the first metal layer, wherein, in the step of the processing treatment of the first metal layer, the wiring is formed in a predetermined position by using at least one of the vias as an alignment marker.

One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XY&#x3b8; direction.

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Osaka, Japan

Shinobu Masuda