Matsushita Electric Industrial Co., Ltd.

Shinobu Kokufu

Takeshi Suzuki

Fumio Echigo

Satoru Tomekawa

Tatsuo Ogawa

Yoshihiro Kawakita

Daizo Andoh

A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.

Method of manufacturing circuit board

A protective agent for protecting a wiring is dispersed and placed in mottle-like on an interface between a via and a wiring layer . Then, each dimension of interface regions where the protective agent does not exist is set to such a size that a plurality of conductive powders constituting the via can abutted on the wiring layer . Therefore, the plurality of conductive powders and the wiring layer are abutted each other in each interface region where the protective agent does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.

Circuit board and its manufacture method

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Osaka, Japan

Shinobu Kokufu