Mitsumi Electric Company Ltd.

Shinobu Kasahara

Tsukasa Yamada

Takahiro Wakasugi

The present invention is to provide an optical scanner module. An optical scanner apparatus scans laser light by oscillating a mirror with a piezoelectric element. A package that mounts the optical scanner apparatus and electrically is connected to a substrate via a connector. A package cover that is fixed to the package and seals the optical scanner apparatus so that the optical scanner apparatus is not visually recognized from an outside. The package and the package cover are bonded by a heat curing adhesive agent. A vent for releasing gas in a space where the optical scanner apparatus is sealed is formed in the package cover, and the vent is blocked by ultraviolet curing resin.

Optical scanner module and method for fabricating optical scanner module

The present invention is to provide an optical scanner module capable of reducing cross-talk generated between a sensor interconnect and a drive interconnect. An optical scanner module, includes an optical scanner apparatus that scans incident light by oscillating a mirror; and a package on which the optical scanner apparatus is mounted, wherein the optical scanner apparatus includes a displacement sensor that detects an oscillation angle of the mirror, wherein a sensor interconnect (P) connected to the displacement sensor and a drive interconnect through which a drive signal for oscillating the mirror passes are respectively drawn from the optical scanner apparatus into the package, wherein interconnect layers (L, L) in which the sensor interconnect and the drive interconnect (P) are formed are stacked, wherein the sensor interconnect and the drive interconnect are placed not to overlap in a plan view of the interconnect layers, and wherein a GND interconnect (P) is provided between the sensor interconnect and the drive interconnect that are adjacent in a same interconnect layer.

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Tokyo, Japan

Shinobu Kasahara